Non-spherical abrasives with ordered mesoporous structures for chemical mechanical polishing  被引量:2

介孔结构非球形磨粒的制备及其在化学机械抛光中的应用研究

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作  者:Peili Gao Tingting Liu Zhenyu Zhang Fanning Meng Run-Ping Ye Jian Liu 郜培丽;刘婷婷;张振宇;孟凡宁;叶闰平;刘健(Key Laboratory for Precision and Non-Traditional Machining Technology of Ministry of Education,Dalian University of Technology,Dalian 116024,China;State Key Laboratory of Catalysis,Dalian Institute of Chemical Physics,Chinese Academy of Sciences,Dalian 116023,China;DICP-Surrey Joint Centre for Future Materials,Department of Chemical and Process Engineering,and Advanced Technology Institute,University of Surrey,Surrey GU27XH,United Kingdom)

机构地区:[1]Key Laboratory for Precision and Non-Traditional Machining Technology of Ministry of Education,Dalian University of Technology,Dalian 116024,China [2]State Key Laboratory of Catalysis,Dalian Institute of Chemical Physics,Chinese Academy of Sciences,Dalian 116023,China [3]DICP-Surrey Joint Centre for Future Materials,Department of Chemical and Process Engineering,and Advanced Technology Institute,University of Surrey,Surrey GU27XH,United Kingdom

出  处:《Science China Materials》2021年第11期2747-2763,共17页中国科学(材料科学(英文版)

基  金:the National Key R&D Program of China(2018YFA0703400);the Xinghai Science Funds for Distinguished Young Scholars;Thousand Youth Talents at Dalian University of Technology,the Collaborative Innovation Center of Major Machine Manufacturing in Liaoning,Liaoning BaiQianWan Talents Program;Dalian National Laboratory for Clean Energy(DNL),DNL Cooperation Fund,Chinese Academy of Sciences(DNL180402)。

摘  要:The chemical mechanical polishing(CMP)technology has been widely used for surface modification of critical materials and components with high quality and efficiency.In a typical CMP process,the mechanical properties of abrasives play a vital role in obtaining the ultra-precision and damage-free surface of wafers for improvement of their performances.In this work,a series of fine structured rod-shaped silica(RmSiO2)-based abrasives with controllable sizes and diverse ordered mesoporous structures were synthesized via a soft template approach,and successfully applied in the sustainable polishing slurry for improving the surface quality of cadmium zinc telluride(CZT)wafers.Compared with commercial silica gel,solid and mesoporous silica spheres,the RmSiO2 abrasives present superior elastic deformation capacity and surface precision machinability on account of their mesoporous structures and rod shapes.Especially,ultra-precision surface roughness and relatively effective material removal speed were achieved by the CMP process using the RmSiO2 abrasives with a length/diameter(L/d)ratio of 1.In addition,a potential CMP mechanism of the developed polishing slurry to CZT wafer was elucidated by analyzing X-ray photoelectron spectra and other characterizations.The proposed interfacial chemical and mechanical effects will provide a new strategy for improving abrasives’machinability and precision manufacture of hard-to-machine materials.化学机械抛光技术通过抛光液中化学试剂的化学腐蚀和纳米磨粒的机械磨削双重耦合作用,在原子水平上去除材料表面缺陷,实现全局平坦化表面加工,现已成为关键零部件和器件材料的超精密表面制造的关键手段.在化学机械抛光加工中,纳米磨粒是外加机械能向抛光系统输入和转化的媒介.磨粒的机械性能很大程度上影响着化学机械抛光加工过程中机械作用的强弱,决定着加工性能的优劣.本文主要针对碲锌镉晶体的软脆难加工特性,对传统实心球形磨粒进行了结构和形貌的双重改性,合成了一系列长径比可控、介孔结构排列有序的棒状二氧化硅磨料.与商用硅溶胶、实心及介孔二氧化硅球形磨粒相比,棒状介孔磨粒由于其类弹簧多孔结构和大尺寸接触面积,在化学机械抛光实验中展现出优异的弹性变形能力和高质高效超精密表面加工能力.此外,通过分析X射线光电子能谱和其他表征结果,本文对所提出的绿色环保化学机械抛光液在碲锌镉晶体化学机械抛光加工中的潜在作用机理进行了说明,这将为改善磨料的切削性和难加工材料的精密制造提供新的策略.

关 键 词:non-spherical abrasives mesoporous structure chemical mechanical polishing interfacial mechanochemistry 

分 类 号:O786[理学—晶体学]

 

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