非水基低介电耐高温胶粘剂的性能研究  

Study on the Performance of Non-aqueous Low-dielectric and High-temperature Resistant Adhesives

作　　者：韩爽[1] 曹先启[1] 陈泽明[1] 李博弘[1] 龙学云 王超[1] HAN Shuang;CAO Xian-qi;CHEN Ze-ming;LI Bo-hong;LONG Xue-yun;WANG Chao(Institute of Petrochemistry,Heilongjiang Academy of Sciences,Harbin 150040,China)

机构地区：[1]黑龙江省科学院石油化学研究院,黑龙江哈尔滨150040

出　　处：《化学与粘合》2021年第5期330-332,339,共4页Chemistry and Adhesion

摘　　要：以醇酮为溶剂的有机/无机杂化树脂为主体,加入低介电活性无机填料、耐热填料、固化促进剂等组成的固化剂,按比例混合后制备非水基低介电耐高温胶粘剂。通过剪切强度测试、差示量热扫描(DSC)分析、热失重(TG)分析、介电常数测试、扫描电子显微镜(SEM)分析等对胶粘剂进行表征。结果表明胶粘剂对复合材料有良好的粘接性能,室温~800℃剪切强度均大于5.3MPa,1000℃内总失重约2.3%,常温介电常数为3.0。The organic/inorganic hybrid resin with alcohol and ketone as the solvent is used as the main body, then a curing agent composed of low-dielectric active inorganic filler, heat-resistant filler and curing accelerator is added to prepare the non-aqueous low-dielectric and high-temper-ature resistant adhesives by mixing them in a certain proportion. The adhesive is characterized through the shear strength test, differential calorimetry scanning(DSC) analysis, thermal weight loss(TG) analysis, dielectric constant test, scanning electron microscope(SEM) analysis, etc. The results show that the adhesive has good bonding properties to the composite materials. The shear strength at room temperature~800 °C is greater than 5.3 MPa;the total weight loss at 1000°C is about 2.3%;and the dielectric constant at room temperature is 3.0.

关 键 词：有机/无机杂化树脂 非水基 低介电 耐高温 

分 类 号：TQ436.9[化学工程]