某瓦片式数字收发组件的多层互联结构设计  

A Multilayer Interconnect Method for a Tile-type Digital T/R Module

作　　者：康颖[1] 雷国忠[1] 崔敏[1] 王洁[1] KANG Ying;LEI Guozhong;CUI Min;WANG Jie(Xi’an Electronic Engineering Research Institute, Xi’an 710100)

机构地区：[1]西安电子工程研究所,西安710100

出　　处：《火控雷达技术》2021年第3期80-84,共5页Fire Control Radar Technology

摘　　要：本文给出了一种瓦片式数字收发组件的多层垂直互联设计方法,该方法有效地解决了瓦片式组件层叠结构高密度装配问题,保证了大功率信号、电源以及小信号的层间传输的完整性,为此类组件的结构设计提供了很好的借鉴和经验。In this paper,a multilayer vertical interconnect method is proposed for a tile-type digital T/R module.The proposed interconnect method enables high-density assembly of stacked structures of the tile-type module and ensures the integrity of high-power signals,power supply,and small signals during transmission between layers.This paper provides some good experience for future design of similar modules.

关 键 词：瓦片式 收发组件 多层 互联 

分 类 号：TN957[电子电信—信号与信息处理]