用于底部填充的低黏环氧树脂胶粘剂的固化性能研究和评价  

Research and evaluation on curing properties of low viscosity epoxy resin adhesivefor underfill

作　　者：王骏[1] 赵富贵[2] 樊竝君 周畅 王伟翰 程珏[2] 张军营[2] 王成刚[1] Wang Jun;Zhao Fugui;Fan Bingjun;Zhou Chang;Wang Weihan;Cheng Jue;Zhang Junying;Wang Chenggang(North China Research Institute of Electo-Optics,Beijing 100015,China;Lab of Adhesive and In-Situ Polymerization Technology,Beijing University of Chemical Technology,Beijing 100029,China;Tlie Seventh Military Representative Office of Air Force Equipment Department in Beijing Area,Beijing 100086,China)

机构地区：[1]华北光电技术研究所,北京100015 [2]北京化工大学胶接材料与原位固化技术研究室,北京100029 [3]空装驻北京地区第七军代表室,北京100086

出　　处：《中国胶粘剂》2021年第9期7-11,共5页China Adhesives

摘　　要：以A-95系列环氧底部填充胶粘剂为对象,研究了不同胶粘剂的黏度和凝胶时间,以此评价了不同胶粘剂在底部填充过程中的流动填充性能和对芯片装配可操作期的影响。通过对不同胶粘剂的固化反应热的表征,确定了固化反应温度,并以此为依据确定了固化工艺。通过本体力学性能、玻璃化转变温度(Tg)、模量和线膨胀系数(CTE)的测试,评价了不同胶粘剂的综合性能。研究结果表明:该系列胶粘剂的室温凝胶时间均大于7 h,满足实际可操作期的要求,固化条件确定为80℃/6 h;室温黏度均小于650 mPa·s,具有较好的流动性能,满足底部填充胶的低黏特性;Tg均大于60℃,但A-80和A-75的模量较小,A-95的CTE最小。通过从固化工艺、本体强度、模量、Tg和CTE等多方面的性能来看,A-90与A-85的综合性能匹配性较高,为底部填充胶粘剂的可靠性评价提供了依据。Taking A-95 series epoxy underfill adhesive as the object,the viscosity and gelation time of different adhesive were studied.The flow filling performance of different adhesive in the underfill process and the effects of different adhesive on the chip assembly operation period were evaluated.By characterizing the curing reaction heat of different adhesive,the curing reaction temperature was determined and the curing process was determined based on this.The comprehensive properties of different adhesive were evaluated by the tests of bulk mechanical properties,glass transition temperature(Tg),modulus and coefficient of thermal expansion(CTE).The research results showed that the gelation time of the series adhesive was more than 7 h at room temperature,which met the requirements of actual operation period,and the curing condition was determined to be 80℃/6 h.The room temperature viscosity was less than 650 mPa·s,which had good flow performance and met the low viscosity characteristic of underfill adhesive.Tgwas greater than 60℃,but the modulus of A-80 and A-75 was relatively small,and the CTE of A-95 was the smallest.From the aspects of curing process,bulk strength,modulus,Tg and CTE,A-90 and A-85 had relatively high comprehensive performance matching,which provided a basis for the reliability evaluation of underfill adhesive.

关 键 词：环氧树脂 低黏 底部填充 CTE 

分 类 号：TQ433[化学工程]