微珠填充对复合泡沫材料电气性能的影响  

Effect of Microbead Content on Electrical Properties of Composite Foam Materials

作　　者：边美华 庞峰 张兴森 黎小林 彭家宁 唐力 BIAN Meihua;PANG Feng;ZHANG Xingsen;LI Xiaolin;PENG Jianing;TANG Li(Electric Power Science Research Institute of Guangxi Power Grid Co.,Ltd.,Nanning 530023,China;Electric Power Research Institute,China Southern Power Grid Co.,Ltd.,Guangzhou 510640,China)

机构地区：[1]广西电网有限责任公司电力科学研究院,广西南宁530023 [2]南方电网科学研究院有限责任公司,广东广州510640

出　　处：《绝缘材料》2021年第10期51-55,共5页Insulating Materials

基　　金：广西电网公司科技项目(ZBKJXM20180533)。

摘　　要：通过在有机硅改性树脂基体中添加中空聚合物微珠制备了一种复合泡沫材料,并将其作为复合绝缘横担的内填充材料,重点分析了微珠类型及填充量对复合泡沫材料密度、憎水性、介质损耗因数以及电气强度等参数的影响规律。结果表明:填充有机微珠可有效降低复合泡沫材料的密度,其中填充920DET40d25型微珠试样的密度可低至0.5538 g/cm^(3);微珠中包含较多的疏水基团,使复合泡沫材料的憎水性有所增强;随着复合泡沫材料中微珠含量的增加,其电气强度有下降趋势,但均满足复合横担内填充材料绝缘强度要求。综合考虑密度及绝缘强度两方面的要求,填充质量分数为2.5%的920DET40d25型微珠的复合泡沫材料满足应用需求。A kind of composite foam material was prepared by adding hollow polymer microbeads to the organosilicon modified resin,and then the composite foam material was used as the internal filling material for the composite insulating cross-arm.The influence rule of the microbead type and filling content on the density,hydrophobicity,dielectric loss factor,and electric strength of the composite foam material was analyzed.The results show that the filling of organic microbeads can effectively reduce the density of the composite foam,and the density of the sample filled with 920DET40d25 microbeads can be reduced to 0.5538 g/cm^(3).Because there are more hydrophobic groups in the microbeads,the hydrophobicity of the composite foam material is enhanced.With the increase of the microbead content,the electric strength of composite foam material shows a downward trend,but the insulation strength of all the samples still meets the requirements of the internal insulation material for composite cross-arms.Considering the requirements of the density and insulation strength of the composite foam material,the sample filled with 920DET40d25 microbeads with a mass fraction of 2.5%meets the application requirements.

关 键 词：复合泡沫 孔隙率 憎水性 介质损耗因数 电气强度 

分 类 号：TM215[一般工业技术—材料科学与工程]