铜铝系中金属间化合物形成机制的研究现状  

Research Status of Formation Mechanism of Intermetallic Phases in Copper-aluminum System

作　　者：吴少鹏 周蕾[1] 蔡晓兰[1] 栗文浩 程远超 WU Shaopeng;ZHOU Lei;CAI Xiaolan;LI Wenhao;CHENG Yuanchao(Faculty of Metallurgical and Energy Engineering,Kunming University of Science and Technology,Kunming 650093,China)

机构地区：[1]昆明理工大学冶金与能源学院,云南昆明650093

出　　处：《昆明理工大学学报（自然科学版）》2021年第5期1-8,共8页Journal of Kunming University of Science and Technology(Natural Science)

基　　金：云南省高校金属粉体制备与设备开发科技创新团队支持计划项目(14051693);云南省基础研究专项(202001AS070049);昆明理工大学分析测试基金项目(2020P20191102017)。

摘　　要：在制备铜铝合金的过程中会有铜铝金属间化合物的形成,其中Cu_(9)Al_(4)和CuAl_(2)相作为铜铝金属间化合物中的两个典型,采用不同的制备方式很大程度上影响了两种金属间化合物形成的顺序.综述了机械合金化与热扩散工艺对铜铝金属间化合物形成的区别及联系.在机械合金化过程中,Cu/Al界面达到微纳米级尺度,非平衡相Cu_(9)Al_(4)要优先于CuAl_(2)相形成,随后相的转变与球磨工艺参数相关.然而在热扩散过程中因其Cu/Al界面远超微米级致使平衡相CuAl_(2)优先形成,烧结温度及保温时间极大地影响了相的形成和生长.此外,从热力学和动力学的角度出发,明晰铜铝系中金属间化合物的形成机制以及Cu/Al界面处金属间化合物的生长规律,这对于调控Cu/Al界面处金属间化合物的形成及生长以提高铜铝界面的结合强度至关重要,以助于铜铝合金、铜铝连接件和铜包铝导线在电力系统、机械、微电子工业、冶金、航空航天等领域得到更好的应用.In the process of preparing copper-aluminum alloys, copper-aluminum intermetallic compounds will be formed. Cu9Al4 and CuAl2 phases are two typical copper-aluminum intermetallic compounds. Different preparation methods will greatly affect the order of the formation of the two intermetallic compounds. The differences and relations between mechanical alloying and thermal diffusion processes on the formation of Cu/Al intermetallic compounds are reviewed in this paper. During mechanical alloying, the Cu/Al interface reaches micro/nano scale, and the non-equilibrium Cu9Al4 phase is formed prior to CuAl2 phase, and the subsequent phase transformation is related to the technological parameters of ball milling. However, the formation of equilibrium phase CuAl2 is preferentially formed because the Cu/Al interface is far beyond the micrometer level in the process of thermal diffusion. The sintering temperature and holding time greatly affect the formation and growth of phase. From the perspective of thermodynamics and dynamics, it is very important to clarify the formation mechanism of intermetallic compounds in the Cu/Al system and the growth law of intermetallic compounds at the Cu/Al interface to regulate the formation and growth of intermetallic compounds at the Cu/Al interface to improve the bonding strength of the Cu/Al interface. To help copper-aluminum alloy, copper-aluminum connector and copper-clad aluminum wire in power system, machinery, microelectronics industry, metallurgy, aerospace and other fields to get better application.

关 键 词：机械合金化 金属间化合物 相互扩散 扩散动力学 Cu-Al系 

分 类 号：TG146[一般工业技术—材料科学与工程]