废弃电路板非金属粉制备水泥基多孔材料的研究  

Study on the preparation of cement base multi-hole material by scrap circuit board grinding powder

作　　者：徐风广[1] 陈浩 陈小卫 杨凤玲[1] XU Fengguang;CHEN Hao;CHEN Xiaowei;YANG Fengling(School of Materials Science and Engineering,Yancheng Institute of Technology,Yancheng 224051,China)

机构地区：[1]盐城工学院材料科学与工程学院,江苏盐城224051

出　　处：《新型建筑材料》2021年第10期30-34,共5页New Building Materials

基　　金：江苏省生态建材与环保装备协同创新中心项目(CP201506)。

摘　　要：利用高铝水泥和废弃电路板非金属粉中玻璃纤维为骨料和粘结剂,废弃电路板非金属粉中树脂等有机物为造孔剂,成功制备了水泥基多孔材料。研究了废弃电路板非金属粉掺量和煅烧温度对水泥基多孔材料性能的影响。结果表明:增加废弃电路板非金属粉掺量,明显提高了显气孔率;通过提高煅烧温度,有效地提高了压缩强度和耐碱腐蚀性能。制备水泥基多孔材料的最佳参数为:煅烧温度750℃,废弃电路板非金属粉掺量为80.0%~83.5%,高铝水泥掺量为15.7%~19.0%,可制得密度为1.36~1.39 g/cm3,显气孔率为47.7%~50.3%,压缩强度为12.8~14.9 MPa,耐碱质量损失率为1.9%~2.4%,耐碱强度损失率为2.45%~3.20%,气孔小、相连而发达的水泥基多孔材料。Cement base multi-hole material were successfully prepared by using high aluminum cement as aggregate and glass fiber in scrap circuit board grinding powder as binder,and using organic materials such as resin in scrap circuit board grinding powder as pore-forming agent.The effects of the amount of scrap circuit board grinding powder and calcination temperature on the properties of cement base multi-hole material were analyzed.Increasing content of scrap circuit board grinding powder could increase apparent porosity,and raising calcination temperature could effectively improve the compressive strength and alkali corrosion resistance.When calcination temperature was 750℃,content of scrap circuit board grinding powder was 80.0%~83.5%,and content of high alumina cement was 15.7%~19.0%,cement base multi-hole material with small pores and well-developed connections could be prepared,bulk density could be made 1.36~1.39 g/cm3,apparent porosity was 47.7%~50.3%,and compressive strength was 12.8~14.9 MPa,and loss rate of alkali-resistant quality was 1.9%~2.4%,and loss rate of alkali-resistant strength was 2.45%~3.20%.

关 键 词：废弃电路板非金属粉 高铝水泥 水泥基多孔材料 

分 类 号：TU525.9[建筑科学—建筑技术科学]