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作 者:石智凯 朱晓云[1] 许磊[2] 罗铜 SHI Zhikai;ZHU Xiaoyun;XU Lei;LUO Tong(School of Materials Science and Engineering,Kunming University of Science and Technology,Kunming 650093,China;School of Metallurgy and Energy Engineering,Kunming University of Science and Technology,Kunming 650093,China)
机构地区:[1]昆明理工大学材料科学与工程学院,云南昆明650093 [2]昆明理工大学冶金与能源工程学院,云南昆明650093
出 处:《材料科学与工程学报》2021年第5期757-762,共6页Journal of Materials Science and Engineering
基 金:昆明理工大学分析测试基金资助项目(2018M20172230004)。
摘 要:为了缩短烧结时间,降低生产成本,提高烧结后银电极的导电性及其与基体的结合力,分别开展了常规烧结和微波烧结陶瓷电容器用导电银浆的研究,以烧结的峰值温度、保温时间设计了对照实验。研究发现,在烧结峰值温度为800℃,保温时间为10min时,常规烧结银电极的电阻为33.29mΩ、附着力为1.39kg,而微波烧结银电极的电阻为28.76mΩ、附着力为1.99kg。与常规烧结相比,微波烧结银电极的电阻减小,附着力增大;常规烧结时间为45~60min,而微波烧结时间为27~34min,烧结时间大幅度缩短;从扫描电镜图可以看出微波烧结银膜比常规烧结银膜的孔洞减少,致密度增加。In order to shorten the sintering time,reduce the production cost,and improve the conductivity of the silver electrode after sintering and its binding force with the substrate,the research on conductive silver paste for conventional sintering and microwave sintering ceramic capacitors was carried out,and the control experiments were designed based on the sintering peak temperature and holding time.It was found that the resistance of the conventional sintered silver electrode was 33.29 mΩand the adhesion was 1.39 kg when the sintering peak temperature was 800℃and the holding time was 10 min,while the resistance of the microwave sintered silver electrode was 28.76 mΩand the adhesion was 1.99 kg.Compared with conventional sintering,the resistance of microwave sintered silver electrode is reduced and the adhesion is increased.The conventional sintering time is 45-60 min,and the microwave sintering time is 27-34 min.The sintering time is greatly shortened.From the scanning electron micrograph,it can be seen that the microwave sintered silver film has a smaller void than the conventional sintered silver film,and the density is increased.
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