Microstructural evolution and thermal conductivity of diamond/Al composites during thermal cycling  

作　　者：Ping-ping Wang Guo-qin Chen Wen-jun Li Hui Li Bo-yu Ju Murid Hussain Wen-shu Yang Gao-hui Wu 

机构地区：[1]School of Materials Science and Engineering,Harbin Institute of Technology,Harbin 150001,China [2]Qiqihar Xiangke New Material Co.,Ltd.,Qiqihar 161005,China [3]Key Laboratory of Advanced Structure-Function Integrated Materials and Green Manufacturing Technology,School of Material Science and Engineering,Harbin Institute of Technology,Harbin 150001,China [4]Beijing Institute of Spacecraft System Engineering,Beijing 100094,China [5]Department of Chemical Engineering,COMSATS University Islamabad,Lahore Campus,Defence Road,Off Raiwind Road,Lahore 54000,Pakistan

出　　处：《International Journal of Minerals,Metallurgy and Materials》2021年第11期1821-1827,共7页矿物冶金与材料学报（英文版）

基　　金：financially supported by the National Natural Science Foundation of China(Nos.1871072,51871073,52171136,51771063,61604086,and U1637201);the China Postdoctoral Science Foundation(Nos.2016M590280 and 2017T100240);the Heilongjiang Postdoctoral Foundation(Nos.LBH-Z16075 and LBH-TZ2014);the Fundamental Research Funds for the Central Universities,China(Nos.HIT.NSRIF.20161 and HIT.MKSTISP.201615).

摘　　要：The microstructural evolution and performance of diamond/Al composites during thermal cycling has rarely been investigated.In the present work,the thermal stability of diamond/Al composites during thermal cycling for up to 200 cycles was explored.Specifically,the thermal conductivity(λ)of the composites was measured and scanning electron microscopy of specific areas in the same samples was carried out to achieve quasi-in situ observations.The interface between the(100)plane of diamond and the Al matrix was well bonded with a zigzag morphology and abundant needle-like Al4C3 phases.By contrast,the interface between the(111)plane of diamond and the Al matrix showed weak bonding and debonded during thermal cycling.The debonding length increased rapidly over the first 100 thermal cycles and then increased slowly in the following 100 cycles.Theλof the diamond/Al composites decreased abruptly over the initial 20 cycles,increased afterward,and then decreased monotonously once more with increasing number of thermal cycles.Decreases in theλof the Al matrix and the corresponding stress concentration at the diamond/Al interface caused by thermal mismatch,rather than interfacial debonding,may be the main factors influencing the decrease inλof the diamond/Al composites,especially in the initial stages of thermal cycling.

关 键 词：metal-matrix composites DIAMOND STABILITY thermal mismatch stress 

分 类 号：TB333[一般工业技术—材料科学与工程]