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作 者:黎金盛 王成刚 黄元盛[2] 余锦耀 林丽霞[2] LI Jinsheng;WANG Chenggang;HUANG Yuansheng;YU Jinyao;LIN Lixia(Jiangmen New Fortune Environmental Housekeeper Technology Co.,Ltd.,Jiangmen 529152,Guangdong,China;Material Technology Department,Jiangmen Polytechnic,Jiangmen 529090,Guangdong,China;Jiangmen Zhongtian Liyan Automobile Accessories Co.,Ltd.,Jiangmen 529152,Guangdong,China)
机构地区:[1]江门新财富环境管家技术有限公司,广东江门529152 [2]江门职业技术学院材料技术系,广东江门529090 [3]江门冢田理研汽车饰件有限公司,广东江门529152
出 处:《金属功能材料》2021年第5期118-122,共5页Metallic Functional Materials
基 金:广东省高熵合金及其复合材料重点实验室培育(江科[2018]352号);广东省普通高校特色创新类项目(2019GKTSCX116);江门市工程技术研究中心项目(江科[2016]161号/[2018]359号);江门市基础与应用基础研究重点项目(2020030102850008923,江科[2020]159号)。
摘 要:进行了PVC薄膜的Cu-Ni-Cr复合镀工艺研究,除物理粗化和化学粗化前处理工序外,后续的脱脂—调整剂处理—钯活化—解胶—化学镀镍—预镀铜—镀酸铜—镀半光镍—镀光镍—镀光亮铬工序均在塑料镀自动加工线上进行。使用金相显微镜、X射线荧光测厚仪(XRF)、精密鼓风干燥箱和扫描电镜(SEM)对复合镀层的厚度、耐热性和表面形貌进行了分析。结果表明,物理粗化方式处理后获得的复合镀层在光亮度、附着力、热冲击性3方面均优于化学粗化方式获得的复合镀层。物理粗化获得的Cu镀层厚度均匀性较差,而Ni镀层厚度均匀性与化学粗化的比较接近,这是由于酸铜镀液分散能力好,填平能力强,从而使两种粗化获得的铜镀层表面都是平整的,但物理粗化的表面粗糙度较大,所以镀铜层厚度均匀性差。而镀镍是以镀铜层为基底,由于镀铜层的表面都很平整,所以两种前处理获得的镍层厚度相差不大。The Cu-Ni-Cr composite electroplating of PVC film was investigated.Except physical coarsening and chemical coarsening,the following degreasing,adjutor treatment,palladium activation,degluing,electroless nickel plating,pre-copper plating,copper acid plating,semi-gloss nickel plating,gloss nickel plating and bright chromium plating processes are all carried out on the plastic plating automatic processing line.The thickness,heat resistance and morphology of Cu-Ni-Cr coatings were analyzed by metallographic microscope,X-ray fluorescence thickness gauge(XRF),precision blast drying oven and scanning electron microscope(SEM).The results showed that the composite coating obtained by physical coarsening was superior to that obtained by chemical coarsening in brightness,adhesion and thermal impact.Physical coarsening of Cu plating thickness uniformity was poorer,and Ni plating thickness uniformity and chemical roughening were similar,this was because the acid copper plating solution dispersion ability and filling ability were good,thus make both coarsening copper plating surface smooth,but physical coarsening surface roughness was larger,so the copper plating layer thickness uniformity was poor.While the nickel plating was based on the copper plating layer,because the surface of the copper plating layer was very flat,the thickness of the nickel layer obtained by the two pretreatment was not much different.
分 类 号:TQ153[化学工程—电化学工业] TQ325.3
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