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作 者:Chungseok Choi Jin Cai Changsoo Lee Hyuck Mo Lee Mingjie Xu Yu Huang
机构地区:[1]Department of Materials Science and Engineering,University of California,Los Angeles,CA 90095,USA [2]Hydrogen Energy Department,Korea Institute of Energy Research,152 Gajeong-ro,Yuseong-gu,Daejeon 34129,Republic of Korea [3]Department of Materials Science and Engineering,Korea Advanced Institute of Science and Technology,291 Daehak-ro,Yuseong-gu,Daejeon 34141,Republic of Korea [4]Irvine Materials Research Institute(IMRI),University of California,Irvine,CA 92697,USA [5]Department of Materials Science and Engineering,University of California,Irvine,CA 92697,USA
出 处:《Nano Research》2021年第10期3497-3501,共5页纳米研究(英文版)
基 金:TEM work was conducted using the facilities in the electron imaging center of California NanoSystems Institute at the University of California Los Angles and the Irvine Materials Research Institute at the University of California Irvine.C.C.,J.C.and Y.H.acknowledge support by the Office of Naval Research(ONR)(No.N000141712608);C.S.L.and H.M.L.acknowledge support by a National Research Foundation(NRF)of Korea grant funded by the Korean Government(Nos.NRF-2017 R1E1A1A03071049 and NRF-2020R1A5A6017701).
摘 要:Developing highly efficient electrochemical catalysts for carbon dioxide reduction reaction(CO_(2)RR)provides a solution to battle global warming issues resulting from ever-increasing carbon footprint due to human activities.Copper(Cu)is known for its efficiency in CO_(2)RR towards value-added hydrocarbons;hence its unique structural properties along with various Cu alloys have been extensively explored in the past decade.Here,we demonstrate a two-step approach to achieve intimate atomic Cu-Ag interfaces on the surface of Cu nanowires,which show greatly improved CO_(2)RR selectivity towards methane(CH4).The specially designed Cu-Ag interfaces showed an impressive maximum Faradaic efficiency(FE)of 72%towards CH4 production at-1.17 V(vs.reversible hydrogen electrode(RHE)).
关 键 词:electrochemical CO_(2)reduction reaction catalyst copper silver bimetallic interface
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