多层片式瓷介电容基板弯曲强度的失效研究  

Study on failure of bending strength of multi-layer ceramic capacitors

作　　者：范凌云 张琨 李鹏[2] FAN Lingyun;ZHANG Kun;LI Peng(Zhuhai Gree Electric Co.,Ltd.,Zhuhai 519000;China Household Electric Appliance Research Institute,Beijing 100037)

机构地区：[1]珠海格力电器股份有限公司,广东珠海519000 [2]中国家用电器研究院,北京100037

出　　处：《家电科技》2021年第5期148-151,共4页Journal of Appliance Science & Technology

摘　　要：结合空调设备用多层片式瓷介电容器的售后数据,通过对售后失效的片状电容内部结构进行金相观察,分析对比发现:主要失效原因为机械应力导致端电极产生裂纹。经过对来料、生产、运输等环节进行排查,结果表明:多层片式瓷介电容器的主要失效原因是PCB板在安装和运输过程中过度弯曲,导致电容器受到过大机械应力失效。故摸底不同材质、封装、容值的片状电容极限基板弯曲强度,为硬件设计提供相应的数值参考,提高产品的可靠性设计。This disquisition is related to the aftersales data of multi-layer ceramic capacitors for air-condition,by means of the metallographic observation of the internal structure of MLCC.The main failure reason is that the mechanical stress causes the end electrode to crack.After checking the incoming,production transportation and other links,the results show that the main failure reason of MLCC is the excessive bending of PCB board in the process of installation and transportation,which leads to the failure of the capacitor under excessive mechanical stress.Therefore,the bending strength of the MLCC limit substrate of different materials,packages and capacitance values is obtained,which provides a corresponding numerical reference for the hardware design and improves the reliability design of the product.

关 键 词：多层片式瓷介电容(MLCC) 基板弯曲 可靠性 

分 类 号：TM925.1[电气工程—电力电子与电力传动]