激光电流和脉冲时间对激光植球效果的影响  

Influence of Laser Current and Pulse Time on Laser-soldering

作　　者：李刚 王勇[1] 张柯 LI Gang;WANG Yong;ZHANG Ke(No.43 Research Institute of CETC,Hefei 230088,China)

机构地区：[1]中国电子科技集团公司第43研究所,合肥230088

出　　处：《混合微电子技术》2020年第4期39-42,共4页Hybrid Microelectronics Technology

摘　　要：本文探究了激光电流强度和脉冲时间的变化对激光植球效果的影响,通过观察凸点的成型质量及剪切力,对不同植球参数下的植球效果进行分析。结果表明,激光电流大小会影响能否正常出球、糊边以及锡球位置偏移,一定范围内随脉冲时间的增加凸点的剪切力有先升后降的趋势,且脉冲时间过短或过长都会导致锡球位置偏移。在合适的范围内调整电流强度和脉冲时间可以得到较好的植球效果。In this paper,the influence of laser current and laser pulse width one the effect of laser-soldering is investigated,and the effect of laser-soldering under different parameters is analyzed by observing the forming quality and shear force of bumps.The result show that the laser current will affect whether the ball can be discharged normally,the paste edge and the position of solder ball.Within a certain range,with the increase of the laser pulse width,the shear strength of the bumps has a tendency to rise and then fall and the length of the laser pulse width will cause the solder ball position to shift.Adjusting the current intensity and pulse time within the appropriate range can achieve better ball planting effect.

关 键 词：激光植球 激光电流 脉冲时间 剪切力 

分 类 号：TN305.94[电子电信—物理电子学]