热压温度对真空热压法制备Cu-30Ni-5Nb合金组织及性能的影响  

Effect of hot-pressing temperature on microstructure and properties of Cu-30Ni-5Nb alloys prepared by vacuum hot-pressing method

作　　者：侯晨阳 卢百平 HOU Chen-yang;LU Bai-ping(National Defense Key Discipline Laboratory of Light Alloy Processing Science and Technology,Nanchang Hangkong University,Nanchang 330063,China)

机构地区：[1]南昌航空大学轻合金加工科学与技术国防重点学科实验室,南昌330063

出　　处：《粉末冶金技术》2021年第5期434-438,共5页Powder Metallurgy Technology

基　　金：国家高技术研究发展计划资助项目(2013AA064001)。

摘　　要：采用真空热压法制备了Cu–30Ni–5Nb合金,研究了热压温度对合金组织、相对密度、熔点及热导率的影响。结果表明,在800~950℃热压温度范围内,Cu–30Ni–5Nb合金的熔点先降低后升高,900℃时铜合金的熔点最低(1178.92℃);Cu–30Ni–5Nb合金的热导率先增大后减小,900℃时铜合金的热导率最大(30.65 W·m^(−1)·K^(−1))。热压温度为875℃时,Cu–30Ni–5Nb合金具有较好的综合性能,相对密度为98.66%,熔点为1180.86℃,热导率为29.54 W·m^(−1)·K^(−1),且合金屈服强度达到355.74 MPa,符合冷却水套的性能要求。Cu–30Ni–5Nb alloys were prepared by vacuum hot-pressing method.The effects of hot-pressing temperature on the microstructure,relative density,melting point,and thermal conductivity of the Cu–30Ni–5Nb alloys were studied.The results show that,with the increase of the hot-pressing temperature from 800 to 950℃,the melting point of the Cu–30Ni–5Nb alloys firstly decreases and then increases,and the melting point is the lowest(1178.92℃)at 900℃.However,the thermal conductivity of the copper alloys increases firstly and then decreases with the increase of the hot-pressing temperature from 800 to 950℃,and the thermal conductivity is the highest(30.65 W·m^(−1)·K^(−1))at 900℃.When the hot-pressing temperature is 875℃,the Cu–30Ni–5Nb alloys show the good comprehensive properties with the relative density of 98.66%,the melting point of 1180.86℃,the thermal conductivity of 29.54 W·m^(−1)·K^(−1),and the alloy yield strength of 355.74 MPa,which are more suitable for the performance requirements of the cooling water jacket.

关 键 词：热压温度 真空热压法 Cu–30Ni–5Nb合金 组织 性能 

分 类 号：TG146[一般工业技术—材料科学与工程]