玻璃激光焊接过程中玻璃料与基板的耦合行为  

Coupling Behavior Between Glass Frit and Plate During Laser-Assisted Glass Frit Bonding

作　　者：陈根余[1,2] 钟沛新 程少祥 Chen Genyu;Zhong Peixin;Cheng Shaoxiang(State Key Laboratory of Advanced Design and Manufacturing for Vehicle Body,Hunan University,Changsha,Hunan A100S2,China;Laser Research histitute,Hunan University,Changsha,Hunan 410082,China)

机构地区：[1]湖南大学汽车车身先进设计制造国家重点实验室,湖南长沙410082 [2]湖南大学激光研究所,湖南长沙410082

出　　处：《中国激光》2021年第18期43-51,共9页Chinese Journal of Lasers

基　　金：国家重点研发计划(2017YFB1104802)。

摘　　要：随着光电技术的快速发展,填充玻璃料的激光玻璃焊接技术已被广泛用于光电器件的封装领域。为了实现对激光焊接过程的实时监测,保障焊接质量,本课题组搭建了一套针对玻璃激光焊接的实时观测系统,该系统规避了玻璃料在激光作用下产生的杂波干扰;之后,采用该系统观测了玻璃涂料区域未完全连接、完全连接及连接区域扩展三种典型的耦合行为,分析了耦合过程中气孔的产生机制,发现了杂质型气孔在玻璃料与玻璃基板耦合行为中的运动规律,分析了气孔溢出过程中密集型气孔与杂质型气孔相作互用的特点。结合实时观测结果,得到了气孔溢出过程中气孔面积随时间变化的规律。试验结果表明,生成的密集型气孔有助于杂质型气孔的溢出,在丝印宽度为0.8 mm的玻璃料上,通过偏置激光束0.2 mm可以有效控制气孔的溢出方向。Objective With the rapid advancement in optoelectronic technology,laser-assisted glass frit bonding technology is being commonly utilized in the packaging process of photoelectric devices.Despite its popularity,there are defects such as pores,cracks,non-fusion,and low joint strength,whose formation is not yet well understood.To better understand and eliminate these defects,the glass frit bonding process needs to be accurately monitored in real time.Existing works focus on monitoring the important physical parameters but lacks a visual analysis of the bonding process.In this study,we directly observed the coupling process between the molten frit and the base metal surface in glass frit bonding.In addition,we expounded on the expansion mechanism of the glass frit and the formation of pores in the bonding process.The results point to new possibilities for eradicating defects in laser-assisted glass frit bonding.Methods In the test,we use a 0.7mm thick borosilicate glass(Corning EAGLE XG)as the glass substrate and low-temperature frit(BASS)as the frit.The glass substrate is cleaned using ultrasonic waves with a mixture of distilled water and detergent and dried to remove dust,oxides,and other pollutants on the glass surface.The frit is printed on the glass substrate with a 400-mesh silk screen(18μm steel mesh thickness and 10μm film thickness).The silk screen pattern is a straight line(length of 30mm and width of 0.8mm).The sample is placed in a heating furnace to remove impurities.The heating process is divided into three steps:a)First,directly heating the coated glass substrate to 150℃in air to remove the organic solvent;b)then,increasing the temperature to 300℃to burn out the binder;c)finally,heating to the glazing temperature to complete the presintering of the glass frit.Before heating,the specimens are placed at room temperature for 10min.In the heating furnace,the heating rate of the sintering process is maintained at 5℃/min,and the cooling rate is not controlled during the cooling process(Fig.1).Anoth

关 键 词：激光技术 玻璃 激光焊接 耦合行为 气孔 

分 类 号：TN249[电子电信—物理电子学]