环氧树脂E-51/双氰胺/有机脲类促进剂体系中温固化实验研究  

Experimental study on medium temperature curing of epoxy resin E-51/dicyandiamide/organic urea accelerator system

作　　者：石文超 刘任 方伟 谢富原 翟华 SHI Wenchao;LIU Ren;FANG Wei;XIE Fuyuan;ZHAI Hua(Institute of Industrial and Equipment Technology,Hefei University of Technology,Hefei 230009,Anhui China;Key Laboratory of Aeronautical Structure Forming Manufacturing and Equipment of Anhui Province,Hefei 230009,Anhui China;Zhejiang Tuanyuan Composite Material Co.,Ltd.,Pinghu 314200,Zhejiang China)

机构地区：[1]合肥工业大学工业与装备技术研究院,安徽合肥230009 [2]航空结构件成形制造与装备安徽省重点实验室,安徽合肥230009 [3]浙江抟原复合材料有限公司,浙江平湖314200

出　　处：《锻压装备与制造技术》2021年第5期106-108,共3页China Metalforming Equipment & Manufacturing Technology

基　　金：中央高校基本科研业务费专项资金资助项目(JZ2020HGTB0039)。

摘　　要：采用动态差示扫描量热法研究了环氧树脂E-51/双氰胺/有机脲类促进剂体系的固化过程,研究了固化剂和促进剂用量的最佳配比,确定了固化工艺。结果表明:双氰胺和有机脲类促进剂的最佳用量分别为7和1phr,固化工艺为90℃/3h+110℃/1h+130℃/1h,其固化产物固化度可达97.4%,玻璃化转变温度为131.17℃。The curing process of epoxy resin E-51/dicyandiamide/organic urea accelerator system has been studied by dynamic differential scanning calorimetry,while the best ratio of curing agent and accelerator dosage has been studied and the curing process has been determined.The results show that the optimal dosages of dicyandiamide and organic urea accelerators are 7 and 1 phr,respectively.The curing process is 90℃/3h+110℃/1h+130℃/1h,and the curing degree of the cured product can reach 97.4%.The glass transition temperature is 131.17°C.

关 键 词：环氧树脂 中温体系 固化工艺 

分 类 号：TQ323.5[化学工程—合成树脂塑料工业]