半导体企业危险源特征与评价案例分析  

Characteristics of Hazard Sources in Semiconductor Enterprises and Case Study

作　　者：石斌 刘润滋 SHI Bin;LIU Run-zi(Beijing GXAK Technology Ltd.,Beijing 100160,China)

机构地区：[1]北京国信安科技术有限公司,北京100160

出　　处：《化工管理》2021年第31期87-88,共2页Chemical Engineering Management

摘　　要：半导体的加工制造涉及多种易燃易爆与含毒性的危化品,这些危化品的使用与储存将给相关企业带来安全隐患。文章通过对半导体制造工艺进行分析,阐释了半导体企业危险源的特征,半导体企业的选址存在劳动力与原料需求同企业安全风险间的矛盾,常见的半导体清洗、蚀刻与掺杂等工艺均需一定的气体环境,并使用多种化学药剂,因而涉及氨气、氯气等多种易燃易爆气体,以及异丙醇、环己酮等易燃化学药剂。因此,半导体企业选址不仅需关注与周边交通枢纽及居民区的安全距离,还需关注主体生产区域及气体储存供应系统多种危化气体带来的安全隐患。Semiconductor manufacturing involves a variety of flammable,explosive and toxic dangerous chemicals.The use and storage of these dangerous chemicals will bring security risks to the relevant enterprises.Through the analysis of semiconductor manufacturing process,this paper explains the characteristics of hazard sources in semiconductor enterprises.There is a contradiction between the demand for labor and raw materials and the safety risk in the location of semiconductor enterprises.Common semiconductor cleaning,etching,doping and other processes need a certain gas environment,and use a variety of chemicals,which involves a variety of flammable and explosive gases such as ammonia,chlorine,and flammable chemicals such as isopropanol and cyclohexanone.Therefore,semiconductor enterprises should not only pay attention to the safe distance from the surrounding transportation hub and residential area,but also pay attention to the potential safety hazards caused by a variety of hazardous gases in the main production area and gas storage and supply system.

关 键 词：半导体加工 危险源识别 危化品堆存 安全评价 

分 类 号：X78[环境科学与工程—环境工程]