一种S波段大功率4×4瓦片式数字T/R组件设计  

Design of a S-Band High Power 4×4 Tile Type Digital T/R Module

作　　者：崔敏[1] 雷国忠[1] 王洁[1] 康颖[1] 周海进[1] CUI Min;LEI Guo-zhong;WANG Jie;KANG Ying;ZHOU Hai-jin(Xi'an Electronic Engineering Research Institute,Xi'an 710100,China)

机构地区：[1]西安电子工程研究所,西安710100

出　　处：《微波学报》2021年第5期58-62,共5页Journal of Microwaves

摘　　要：设计了一种S波段大功率4×4瓦片式数字T/R组件,采用数模混合收发SoC(片上系统)及三维立体集成等技术实现了高集成、小型化、轻量化、模块化及低成本的要求。T/R组件在S波段单通道输出功率≥100 W,体积和重量相比于传统砖块式组件均减小了50%,具有不可比拟的优势,更易于实现大规模阵列集成,具有低剖面、可共形、可升级重构的特点。研制结果充分验证了该设计的可行性及可扩展性,能够更好地满足不同雷达和通信需求。A S-band high power 4×4 tile type digital T/R module is designed, using digital-analog hybrid transceiver SoC(System on Chip) and three-dimensional integration technology to achieve the requirements of high integration, miniaturization, lightweight, modularization and low cost. The output power of single channel of T/R module in S band is more than 100 W, and the volume and weight of T/R module are reduced by 50% compared with traditional brick type module. It has incomparable advantages, and is easier to realize large-scale array integration. It has the characteristics of low profile, conformal, scalable and reconfigurable. The development results fully verify the feasibility and scalability of the design, which can better meet the demands of different radar and communication system.

关 键 词：数字T/R组件 瓦片式 大功率 数模混合收发SoC 三维立体集成 

分 类 号：TN958.92[电子电信—信号与信息处理]