温度场下岛-桥结构屈曲薄膜的动力学分析  

Dynamic Analysis of the Buckled Thin Film in Island-interconnector Structure under Temperature Field

作　　者：吴文斌 王博[1] 王振洋 周煜棠 邓子辰[1,2] Wenbin Wu;Bo Wang;Zhenyang Wang;Yutang Zhou;Zichen Deng(Department of Engineering Mechanics,Northwestern Polytechnical University,Xi'an,710072;Ministry of Industry and Information Technology Key Laboratory of Dynamics and Control of Complex Systems,Northwestern Polytechnical University,Xi'an,710072)

机构地区：[1]西北工业大学工程力学系,西安710072 [2]西北工业大学复杂系统动力学与控制工信部重点实验室,西安710072

出　　处：《固体力学学报》2021年第5期543-551,共9页Chinese Journal of Solid Mechanics

基　　金：国家自然科学基金项目(11802319)资助。

摘　　要：基于岛-桥结构的柔性电子器件已被用于健康监测和皮肤电子等领域.但是柔性电子器件在工作中极易受工作温度变化等激励产生振动,进而影响器件的灵敏度与可靠性.因此论文研究在温度场作用下岛-桥结构屈曲薄膜的动力学问题.首先,基于Euler-Bernoulli梁理论,建立温度场作用下岛-桥结构屈曲薄膜的动力学控制方程.其次,通过引入新变量,将原动力学方程引入Hamilton体系中,得到相应的Hamilton正则方程.随后,采用辛Runge-Kutta方法求解该Hamilton正则方程,并与经典Runge-Kutta方法对比,数值结果显示了辛算法在求解非线性动力学方程时高精度、高数值稳定性的优势,进一步讨论了温度变化量、预应变、阻尼系数等对屈曲薄膜动力学响应的影响.论文研究为柔性电子器件动力学设计提供了理论参考.The island-interconnector type flexible electronic devices have been used in daily life, such as monitoring the blood pressure, heart rate, body temperature, and other biophysical and biochemical signals. Considering that these kinds of flexible electronic devices would work in a complex environment, their dynamic behaviours would be influenced. In this paper, the dynamic behaviours of the buckled interconnector, which is subjected to the temperature field, are studied. Firstly, based on the Euler-Bernoulli beam theory, the governing equation of the buckled interconnector is derived. Secondly, by introducing new variables, the second-order dynamic equation is transformed into one-order dynamic equations. Then, the symplectic Runge-Kutta method is used to solve the corresponding equations. From the numerical results, one can find that the results obtained by the symplectic Runge-Kutta method is more stable than that obtained by the classical Runge-Kutta method. Thus, in the following dynamic analysis, the symplectic Runge-Kutta method is adopted. In addition, from several numerical examples, the influences of the temperature change and pre-stain on the dynamic response of the buckled structure are discussed. Through these numerical examples, one can find that the natural frequency of the buckled interconnector is affected by the temperature change and pre-strain. When the thermal expansion coefficient is taken as a positive value, with the increase of the temperature change and pre-strain, the natural frequency of the buckled thin film increases. For the fixed temperature change, the higher the pre-strain, the higher the vibration amplitude;and for the fixed pre-strain, the higher the temperature change, the higher the vibration amplitude. When the thermal expansion coefficient is taken as a negative value, with the increase of the temperature change, the vibration amplitude of the buckled structure would decrease. The numerical results of this paper would be useful for the design of novel flexible electronic devi

关 键 词：柔性电子 薄膜 温度影响 辛Runge-Kutta方法 动态屈曲 

分 类 号：TB383.2[一般工业技术—材料科学与工程]