5G用铁氧体/介质陶瓷复合基片的加工制备技术  

Processing and preparation technology of ferrite/dielectric ceramic assemble substrates for 5G wireless communication

作　　者：杨菲 袁红兰 陈建杰 唐才金 郭韦 YANG Fei;YUAN Hong-lan;CHEN Jian-jie;TANG Cai-jin;GUO Wei(Ninth Institute,China Electronics Technology Corporation,Mianyang621000,China)

机构地区：[1]中国电子科技集团公司第九研究所,四川绵阳621000

出　　处：《磁性材料及器件》2021年第5期53-56,共4页Journal of Magnetic Materials and Devices

摘　　要：针对铁氧体-介质陶瓷(FDA)复合基片的一些加工制备工艺进行了研究,采用挤压成型工艺结合精准烧结控制技术,可极大地改善小尺寸的薄壁介质环烧结变形情况,提高介质陶瓷管内径加工效率。通过精密匹配加工工艺可显著减小微波铁氧体与介质陶瓷间粘接层厚度,解决匹配不佳造成的漏光等不合格现象,提升FDA基片合格率。控制半成品外径加工余量,可有效解决FDA基片的同心度问题,将同心度合格率由78.13%提升至98%。最终,提升了FDA基片的批生产加工质量。The processing technology of ferrite/dielectric ceramic assemble(FDA)substrates was studied,it is found that the extrusion process combined with precise sintering control technology can greatly improve the sintering distortion of small-sized thin-walled dielectric ring and improve the processing efficiency of dielectric ceramic ring inner diameter.Through precise matching processing technology,the thickness of bonding layer between microwave ferrite and dielectric ceramics can be significantly reduced,which can solve the problem of light leakage caused by poor matching,and improve the qualified rate of FDA substrate.The concentricity problem of FDA substrate was effectively solved by controlling the processing allowance of the outer diameter of semi-finished products.The qualified rate of concentricity was increased from 78.13%to 98%.Finally,the quality of FDA substrates production was improved.

关 键 词：铁氧体-介质陶瓷基片 精密匹配加工 烧结变形量 同心度 合格率 

分 类 号：TN61[电子电信—电路与系统]