气氛置换法对缓解硅铝封装氦气吸附影响研究  

Research on the Effect of Atmosphere Replacement on Alleviating the Adsorption of Helium of Aluminum-Silicon Package

作　　者：王斌 罗捷 邱宝军[1] 王之哲 周帅[2] 王小强[2] WANG Bin;LUO Jie;QIU Baojun;WANG Zhizhe;ZHOU Shuai;WANG Xiaoqiang(CEPREI,Guangzhou 511370,China)

机构地区：[1]工业和信息化部电子第五研究所元器件检测中心,广东广州511370 [2]工业和信息化部电子第五研究所,广东广州511370

出　　处：《电子产品可靠性与环境试验》2021年第5期19-23,共5页Electronic Product Reliability and Environmental Testing

摘　　要：为了有效地缓解铝硅材料表面的氦气吸附,保证铝硅封装器件密封试验结果的准确性,创新性地提出使用非示踪气体置换硅铝表面吸附氦气的方法。通过比对不同置换气体对氦气去吸附效果的影响,可以发现二氧化碳的去除效率最高,其次是氩气,氮气的效果较差。但二氧化碳的渗入,有可能导致器件内部气氛超标进而导致失效,因此优先推荐氩气作为置换气体。In order to effectively alleviate the adsorption of helium on the surface of aluminumsilicon materials and ensure the accuracy of the sealing test results of aluminum-silicon packaged devices,a method of replacing the absorption of helium on the surface of silicon-aluinum with a non-tracer gas is innovatively proposed.By comparing the effects of different replacement gases on the desorption effect on helium,it can be found that the removal efficiency of carbon dioxide is the highest,and the effect of argon is second,and the effect of mitrogen is poor.However,the infiltration of carbon dioxide may cause the internal atmosphere of the device to exceed the standard and cause failure.Therefore,argon is recommended as the replacement gas.

关 键 词：硅铝封装 密封 细检漏 气氛置换法 

分 类 号：F407.63[经济管理—产业经济]