直流风机驱动电路板的失效分析  

The Failure Analysis of Drive Board for DC Fan

作　　者：张旭武 张浩敏 陈铁柱 ZHANG Xuwu;ZHANG Haomin;CHEN Tiezhu(CEPREI,Guangzhou 511370,China;Ningbo CEPREI IT Research Institule Co.,Ltd.,Ningbo 315040,China)

机构地区：[1]工业和信息化部电子第五研究所,广东广州511370 [2]宁波赛宝信息产业技术研究院有限公司,浙江宁波315040

出　　处：《电子产品可靠性与环境试验》2021年第5期43-50,共8页Electronic Product Reliability and Environmental Testing

摘　　要：为了确认直流风机驱动电路板失效的具体原因,利用光学显微镜观察、电特性测试、X射线(X-ray)检查、扫描电镜和能谱分析方法对直流风机驱动电路板上的关键器件及相关的IC进行分析,最终得出结论,认为机械应力是直流风机驱动电路板失效的主要原因。In order to confirm the specific reasons for the failure of the DC fan drive circuit board,the key components and related IC on the DC fan drive circuit board are analyzed by using optical microscope observation,electrical characteristic test,X-ray inspection,scanning electron microscope and energy spectrum analysis methods,and finally it is concluded that the mechanical stress is the main reason for the failure of the DC fan drive circuit board.

关 键 词：直流风机 驱动电路板 焊点开裂 机械应力 失效分析 

分 类 号：TM315[电气工程—电机]