双面光极薄电解铜箔制备及其微观组织与性能研究  

Preparation,micro-structure and performance of double shiny ultra-thin electrolytic copper foil

作　　者：韩国强 秦丽娟 孙宁磊[1] 刘国[1] 王魁珽[1] HAN Guo-qiang;QIN Li-juan;SUN Ning-lei;LIU Guo;WANG Kui-ting

机构地区：[1]中国恩菲工程技术有限公司,北京100038

出　　处：《中国有色冶金》2021年第4期13-18,共6页China Nonferrous Metallurgy

摘　　要：电解铜箔是覆铜板(CCL)、印制电路板(PCB)及锂离子电池制造的重要材料,极薄铜箔将成为市场的主导产品。本文通过调整电解铜箔工艺参数及控制添加剂比例,制得了组织均匀、性能优良的厚度为4.5μm的高纯双面光极薄铜箔,并利用XRD、SEM、粗糙度仪和万能试验机等分别对铜箔的组织、形貌及性能进行分析。结果表明:极薄铜箔的纯度高(铜含量99.98%),杂质含量极低(<0.001%),且铜箔面密度和厚度均匀,波动均在1%以内;影响铜箔抗拉强度的(111)织构为择优取向,系数为58.8,影响铜箔伸长率的(220)织构系数较低;双面光极薄铜箔毛面的颗粒较小,分布均匀,呈丘陵状结构存在,且其横向和纵向粗糙度均在合理范围内波动;极薄铜箔具有优异的力学性能,抗拉强度可达671.54±20 MPa,断裂伸长率为5.81%±3.2%,显著优于市场上厚度6μm和8μm铜箔的力学性能,同时经钝化处理后具有较好的高温抗氧化性。Electrolytic copper foils serve as crucial raw materials of CCL,PCB and lithium ion batteries,and ultrathin copper foils will become the leading product in the market. By adjusting process parameters of electrolytic copper foil and controlling the proportion of additives,high purity and double shiny ultra-thin copper foils with uniform structure,great performance and a thickness of 4. 5 μm are produced,and its structure,appearance and performance are analyzed by using XRD,SEM,roughness meter and universal testing machine. Results show that ultrathin copper foils are of high purity (99. 98% Cu) and have an extremely low content of impurities (< 0. 001%).They have uniform surface density and thickness with a fluctuation within 1%. The (111) texture that affects their tensile strength is preferred orientation and the coefficient is 58. 8;the (220) texture coefficient that affects their elongation is relatively low. The matte surface of double shiny ultra-thin copper foil is evenly distributed by small particles of hilly structure,and the horizontal and vertical roughness fluctuates within a reasonable range. Ultra-thin copper foils boast excellent mechanical properties,with tensile strength of 671. 54 ± 20 MPa and elongation at break of 5. 81% ± 3. 2%,which are remarkably better than those of 6 μm and 8 μm copper foils in the market. Besides,ultra-thin copper foils can acquire high-temperature oxidation resistance after passivation.

关 键 词：极薄电解铜箔 双面光 表面粗糙度 择优取向 纯度 抗拉强度 断裂伸长率 高温抗氧化性 

分 类 号：TG146.11[一般工业技术—材料科学与工程] TF803.27[金属学及工艺—金属材料]