基于Fluent的新型平行流铜电解槽内流场数值模拟  

Fluent-based numerical simulation of the flow field in copper electrolytic cell fed by new-type parallel flow

作　　者：随从亚 董为民[1] 龚梦 浦玲江 王鑫[1] SUI Cong-ya;DONG Wei-min;GONG Meng;PU Ling-jiang;WANG Xin

机构地区：[1]昆明理工大学机电工程学院,云南昆明650500

出　　处：《中国有色冶金》2021年第4期43-48,共6页China Nonferrous Metallurgy

摘　　要：铜电解液流场对电解槽内离子浓度、温度分布及阳极泥沉降等有重要意义,本文以国内某铜电解槽为原型,运用Fluent软件对单侧平行流、双向平行流及新型平行流进液方式进行了数值模拟。模拟结果表明:单侧平行流的电解液流动方向是从下至上,容易将电解槽内沉降的阳极泥扬起,导致阴极铜纯度不高,并且不利于阳极泥的合理回收;双向平行流的电解液由上而下流动,进口处流速高,流场内的速度差造成回流,不利于阳极泥的沉降;新型平行流的进液方式基于双向平行流进行了改进,减少了进、出口数量,两侧进液口存在高度差,使得大部分电解液进入极板间,电解槽底部流速较小,具有流场流速均匀稳定、电解周期短、便于后期检修的优点。Copper electrolyte flow field is of great importance to the ion concentration,temperature distribution and anode slime settling in electrolytic cells. In this paper,Fluent-based numerical simulation has been conducted on a domestic copper electrolytic cell in terms of three different feeding modes of electrolyte,i. e.,one-side parallel flow,bidirectional parallel flow and new-type parallel flow. The simulation results show that in the one-side parallel flow feeding mode,the electrolyte flows from bottom to top,which is easy to stir up the anode slime settled in the cell,causing low-purity of cathode copper and unfavorable for the reasonable recovery of anode slime;in the bidirectional parallel flow feeding mode,the electrolyte flows from top to bottom,the flow velocity at the inlet is high,the velocity difference in the flow field may cause backflow,unfavorable for anode slime settling;the new-type parallel flow is an upgrade of the bidirectional parallel flow,in this feeding mode,the number of feeding and discharge ports is reduced,the inlets on two sides is different in height,which makes most of electrolyte enter between plates and reduces the flow velocity at the cell bottom. It boasts the advantages of uniform and stable velocity at flow field,short electrolysis cycle and convenience in maintenance.

关 键 词：铜电解 电解液流场 数值模拟 单侧平行流 双向平行流 新型平行流 流速均匀 电解周期 

分 类 号：TF811[冶金工程—有色金属冶金] TF8G3.27