采用流胶型半固化片的0.2 mm台阶槽板加工方法研究  

Study on processing of 0.2 mm step groove PCB with prepreg as flow type

作　　者：黄先广 张可权 周飞 钟岳松 Huang Xianguang;Zhang Kequan;Zhou Fei;Zhong Yuesong

机构地区：[1]深圳市牧泰莱电路技术有限公司,广东深圳518103

出　　处：《印制电路信息》2021年第11期27-30,共4页Printed Circuit Information

摘　　要：高频高速含台阶印制板朝着微小精密化发展。台阶板常规制作方法是采用内层开槽,槽内使用缓冲垫片,压合后控深揭盖,取出垫片的工艺方法制作。0.2 mm介厚的台阶槽,溢胶量小于0.1 mm,无法使用常规方法实现效果。文章针对该类台阶板,探索研究了4种加工方法,进行对比测试,最后选择满足特殊要求的板件制作方法。The high-frequency and high-speed printed circuit board with step groove is developing towards micro precision.The conventional manufacturing method of step plate is to adopt the process of slotting in the inner layer,using buffer gasket in the groove,controlling the depth,uncovering the cover and taking out the gasket after pressing.For the 0.2 mm thick step groove,the glue overflow is less than 0.1mm,which cannot be achieved by conventional methods.Aiming at this kind of step plate,this paper explores and studies four processing methods,compares and tests them,and finally selects the plate manufacturing method that meets the special requirements.

关 键 词：台阶槽 激光切割 溢胶量 高频高速印制板 

分 类 号：TN41[电子电信—微电子学与固体电子学]