激光切割工艺路径的双染色体遗传算法优化  

Optimization of double-chromosome genetic algorithm for laser cutting technology path

作　　者：宋磊 王欣欣 刘晓彦 隋庆如 Song Lei;Wang Xinxin;Liu Xiaoyan;Sui Qingru(Institute of Intelligent Manufacturing,Changchun University of Science and Technology,Changchun 130600,China)

机构地区：[1]长春科技学院智能制造学院,吉林长春130600

出　　处：《锻压技术》2021年第10期119-125,共7页Forging & Stamping Technology

基　　金：吉林省高教科研课题(JGJX2020D548)。

摘　　要：为了减小激光切割板材的空行路程和激光加工引起的板材升温,提出了基于双染色体遗传算法的切割路径规划方法。给出了轮廓特征点的选择方法,对轮廓间路径规划问题进行了数学描述,并建立了切割路径规划的多目标函数。针对切割起点确定和切割路径规划的联合求解问题,设计了双染色体编码方式,从而提出了双染色体遗传算法。该算法针对激光切割路径规划的特殊性,对交叉操作和变异操作进行了适应性设计,并给出了双染色体遗传算法对激光切割路径的规划流程。在10 m×5 m排样板材上进行路径规划验证,厂家CAM软件规划路径的空行路程为54.78 m,双染色体遗传算法规划路径的空行路程为39.65 m,比CAM软件规划的结果减少了27.62%;厂家CAM软件规划路径切割的板材的最高温度为252.67℃,双染色体遗传算法规划路径加工时的最高温度为152.23℃,比CAM软件规划路径的最高温度减少了39.75%。以上数据证明了双染色体遗传算法在激光切割路径规划中的优越性。In order to reduce non-working path of laser cutting plates and temperature-rise of plate caused by laser processing,a cutting path planning method based on double-chromosome genetic algorithm was proposed,and the selection method of contour feature points was given.Then,the problem of path planning between contours was described mathematically,and the multi-objective function of cutting path planning was established.Furthermore,for the joint solving problems of determination for cutting starting point and cutting path planning,a double-chromosome coding method was designed,and a double-chromosome genetic algorithm was put forward.In view of the particularity for laser cutting path planning,crossover operation and mutation operation were designed adaptively,and the planning process of laser cutting path based on double-chromosome genetic algorithm was given.The verification of path planning on a layout plate of 10 m×5 m shows that the non-working path planned by vender software CAM is 54.78 m,and non-working path planned by double-chromosome genetic algorithm is 39.65 m,which is 27.62%less than the result of the vender software CAM planning.In addition,the maximum temperature of the plate cut by vender software CAM planning path is 252.67℃,and the maximum temperature in processing by double-chromosome genetic algorithm planning path is 152.23℃,which is 39.75%lower than the former.Thus,the data above indicates the superiority of double-chromosome genetic algorithm in laser cutting path planning.

关 键 词：激光切割路径规划 双染色体遗传算法 轮廓特征点 多目标函数 空行路程 

分 类 号：TH164[机械工程—机械制造及自动化] TG458[金属学及工艺—焊接]