弹载固态存储器防护结构的隔热研究  

Thermal insulation analysis of missile borne solid state memory protection structure

作　　者：白玉 尤文斌[1] 丁永红[1] 胡时光 张中凯 Bai Yu;You Wenbin;Ding Yonghong;Hu Shiguang;Zhang Zhongkai(National Key Laboratory for Electronic Measurement Technology,North University of China,Taiyuan 030051,China)

机构地区：[1]中北大学电子测试技术国家重点实验室,太原030051

出　　处：《国外电子测量技术》2021年第9期59-63,共5页Foreign Electronic Measurement Technology

基　　金：国家自然科学基金(61701445);中北大学重点实验室开放研究基金(DXMBJJ2020-07)项目资助。

摘　　要：针对弹载固态存储器在发射到回收的过程中,因剩余燃料燃烧以及高温尾焰等外部因素造成的固态存储器持续受高温灼烧,对电路板及各元件造成损伤的问题,设计了一种体积小、具有良好隔热性能的多层热防护结构,并对固态存储器关键组件热防护薄弱点针对性设计了新型防护结构,利用ABAQUS软件对比分析相同时间与相同边界条件情况下有无隔热层结构的传热过程,对比结果表明,该结构处于530℃的高温环境中900 s后内壳温度不到40℃,仅为无隔热层结构的25%,有效地减小了热量的传递,确保内部存储电路能够正常工作,最后用实验验证了该防护结构隔热性能的正确性。The solid state memory is continuously burned by high temperature due to external factors such as residual fuel combustion and high temperature tail flame in the process from launch to recovery.therefore,the circuit board and various components are damaged.In order to solve this problem,a multi-layer thermal protection structure with small size and good thermal insulation performance was designed,and a new type of protection structure was designed for the weak points of the thermal protection of the key components of the solid state memory.Use the ABAQUS software to compare and analyze the heat transfer process with or without the insulation layer structure under the same time and the same boundary conditions.The results show that the inner shell temperature of the structure is less than 40℃ after 900 s in a high temperature environment of 530℃,which is only 25% of the structure without heat insulation layer.This structure effectively reduces the heat transfer and ensures that the internal storage circuit can work normally.Finally,experiments are used to verify the correctness of the thermal insulation performance of the protective structure.

关 键 词：固态存储器 传热分析 隔热 可靠性 

分 类 号：TJ410.6[兵器科学与技术—火炮、自动武器与弹药工程]