灌封型速度传感器受热应力影响的研究  

Research on the Influence of Thermal Stress on Speed Sensor

作　　者：刘丹 刘莉娜 郑良广 张燕亮 LIU Dan;LIU Lina;ZHENG Liangguang;ZHANG Yanliang(Ningbo CRRC Times Transducer Technique Co.,Ltd.,Ningbo 315021,China;Hunan Automotive Engineering Vocational College,Zhuzhou 421001,China)

机构地区：[1]宁波中车时代传感技术有限公司,浙江省宁波市315021 [2]湖南汽车工程职业学院,湖南省株洲市412001

出　　处：《传感器世界》2021年第10期11-15,共5页Sensor World

摘　　要：文章以灌封型速度传感器在研发阶段的可靠性极限试验结果为分析源头,通过对完成极限试验的样品进行X-ray及解剖分析,确认极限环境下存在灌封材料热应力不平衡问题,进而导致器件焊点开裂。通过有限元分析、温度变化试验模拟,在快速温变过程中,灌封材料内部的热应力超过焊点强度极限。通过:仿真分析,确定提升产品耐快温变环境的方向;通过应力计算,细化产品优化方案。完成样机研制及验证,确认热应力平衡解决方案的可行性,从而提升极限环境下的产品可靠性。In the paper,taking the reliability limit test results of the potting speed sensor in research phase as the data base of analysis,together with X-ray and anatomical analysis of the samples that have been through the limit test,come to the conclusion that there is an imbalance in the internal stress of the potting material under extreme environment,which leads to cracking of the solder joints of the device.Through finite element analysis and temperature change test simulation,in the process of rapid temperature change,the thermal stress inside the potting material exceeds the strength limit of the solder joint.By simulation analysis to find the direction to improve the product's resistance against rapid temperature change.By stress calculation to refine the product design plan.By prototype development and verification to confirm the feasibility of the thermal stress balance solution,so as to improve the reliability of the product under the extreme environment.

关 键 词：灌封型速度传感器 灌封材料 热应力 有限元分析 可靠性 

分 类 号：TP212[自动化与计算机技术—检测技术与自动化装置]