软熔工艺对低锡量镀锡板耐蚀性的影响  

Effect of reflow process on corrosion resistance of low-tin tinplate

作　　者：刘伟[1] 万一群[1] 齐韦 沈鹏杰 王爱红[1] 王伟[1] LIU Wei;WAN Yiqun;QI Wei;SHEN Pengjie;WANG Aihong;WANG Wei(Shougang Jingtang United Iron&Steel Co.,Ltd.,Tangshan 063000,China;Shanghai Wubao Mechatronic Technology Co.,Ltd.,Shanghai 200940,China)

机构地区：[1]首钢京唐钢铁联合有限责任公司,河北唐山063200 [2]上海务宝机电科技有限公司,上海200940

出　　处：《电镀与涂饰》2021年第21期1622-1626,共5页Electroplating & Finishing

摘　　要：采用高速镀锡模拟装置制备了镀锡量为1.1 g/m^(2)的镀锡板。研究了不同助熔剂和合金比例对镀锡板耐蚀性的影响。结果表明,采用去离子水助熔时低锡镀锡板的耐蚀性最好,较佳的合金比例为30%~40%。Tinplates with a tin coating of 1.1 g/m^(2) were prepared using a high-speed tin electroplating simulator.The effects of different fluxes and alloy proportion on the corrosion resistance of tinplate was studied.The results showed that the tinplate with low mass of tin coating had the best corrosion resistance after being refluxed using deionized water as a flux,and the suitable alloy proportions were 30%to 40%.

关 键 词：镀锡板 软熔 助熔剂 合金比例 锡层 连续性 耐蚀性 

分 类 号：TQ153.13[化学工程—电化学工业]