电子器件用低膨胀聚酰亚胺薄膜研究进展  

Research Progress in Low Expansion Polyimide Films for Electronic Devices

作　　者：卢小闯 余文涛 翁梦蔓 刘屹东 张继升 方基永 闵永刚 LU Xiaochuang;YU Wentao;WENG Mengman;LIU Yidong;ZHANG Jisheng;FANG Jiyong;MIN Yonggang(School of Materials and Energy,Guangdong University of Technology,Guangzhou 510006,China;Huimai Material Technology(Guangdong)Co.,Ltd.,Foshan 528200,China)

机构地区：[1]广东工业大学材料与能源学院,广东广州510006 [2]慧迈材料科技(广东)有限公司,广东佛山528200

出　　处：《绝缘材料》2021年第11期11-22,共12页Insulating Materials

基　　金：国家重点研发计划项目(2020YFB0408100);广东省“珠江人才计划”引进创新创业团队项目(2016ZT060412);广州市越秀区科技计划项目(2019-GX-013)。

摘　　要：近年来,柔性电子器件飞速发展,聚酰亚胺(PI)薄膜作为柔性基板材料及介电绝缘材料大规模应用于柔性电子器件和挠性线路板等的制备,但其较高的热膨胀系数降低了它在变温加工过程的尺寸稳定性,故有必要调整其热膨胀系数与构成电子器件的其他材料相匹配。本文主要介绍了国内外低膨胀聚酰亚胺薄膜的专利现况、低膨胀聚酰亚胺复合薄膜的制备和应用研究进展,展望了低膨胀PI合成、改性及应用研究的总趋势。In recent years,flexible electronic devices have developed rapidly.As a flexible substrate material and dielectric insulating material,polyimide(PI)film has been widely used in the preparation of flexible electronic devices and flexible circuit boards.However,its high thermal expansion coefficient reduces its dimensional stability in the process of variable temperature processing.Therefore,it is necessary to adjust its thermal expansion coefficient to match with other materials of electronic devices.In this paper,the patent status of low expansion polyimide films at home and abroad,the preparation and application research progress of low expansion polyimide composite films were introduced,and the general trend of synthesis,modification and application research of low expansion PI was forecasted.

关 键 词：聚酰亚胺 电子器件 专利布局 低膨胀 

分 类 号：TM215.3[一般工业技术—材料科学与工程]