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作 者:马诚 刘述梅[1] 赵建青[1] 陈植耿 黄皓浩[1] MA Cheng;LIU Shumei;ZHAO Jianqing;CHEN Zhigeng;HUANG Haohao(College of Materials Science and Engineering,South China University of Technology,Guangzhou 510640,China)
机构地区:[1]华南理工大学材料科学与工程学院,广东广州510640
出 处:《绝缘材料》2021年第11期69-74,共6页Insulating Materials
基 金:广东省重点领域研发计划项目(2019B010940001)。
摘 要:以4,4′-二氨基-2,2′-双三氟甲基苯(TFMB)和3,3′,4,4′-联苯四羧酸二酐(BPDA)为原料制备聚酰胺酸,采用氮杂环类喹啉(QL)促进其在较低温度下亚胺化,并对QL用量、最高亚胺化温度及固化时间进行了优化。利用红外光谱法测定所得聚酰亚胺(PI)薄膜的亚胺化程度。结果表明:当QL添加量为BPDA物质的量的两倍时,聚酰胺酸在200℃下固化4 h,亚胺化程度即可超过99%;在250℃下处理0.5 h除去残留溶剂和QL后,PI的热稳定性大幅提高,而透光率基本不变。与300℃高温下亚胺化制备的PI薄膜相比,采用QL促进亚胺化的PI薄膜5%热失重温度(T_(5%))、玻璃化转变温度(T_(g))和拉伸强度仅略有下降,而断裂伸长率提高,400 nm处的透光率从4.5%提高到34.4%。A polyamide acid was prepared using 4,4′-diamino-2,2′-bistrifluoromethyl benzene(TFMB)and 3,3′,4,4′-biphenyltetracarboxylic dianhydride(BPDA)as raw materials.The azocyclic quinoline(QL)was used to promote its imidization at lower temperature,and the amount of QL,maximum imidization temperature,and curing time were optimized.The imidization degree of polyimide(PI)film was determined by infrared spectroscopy.The results show that when the molar addition of QL is twice that of BPDA,the polyamide acid is only cured for 4 h at 200℃,the imidization degree is more than 99%.After treated at 250℃for 0.5 h to remove the residual solvent and QL,the thermal stability of the PI is improved greatly,while its light transmittance is basically unchanged.Compared with the PI film imidized at 300℃,the 5%weight loss temperature(T_(5%)),glass transition temperature(T_(g)),and tensile strength of the PI film whose imidization promoted by QL decrease slightly,but the elongation at break increases,and the light transmittance at 400 nm increases from 4.5%to 34.4%.
分 类 号:TM215.3[一般工业技术—材料科学与工程]
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