室温固化有机耐烧蚀胶粘剂的制备  

Preparation of Room Temperature Curing Organic Ablation Resistant Adhesive

作　　者：曹文恺 曹先启[1] 陈泽明[1] 韩爽[1] 李博弘[1] 张守锋 王超[1] CAO Wen-kai;CAO Xian-qi;CHEN Ze-ming;HAN Shuang;LI Bo-hong;ZHANG Shou-feng;WANG Chao(Institute of Petrochemistry,Heilongjiang Academy of Sciences,Harbin 150040,China;Jiaxiang Bureau of industry and information techndogy,Jining 272400,China)

机构地区：[1]黑龙江省科学院石油化学研究院,黑龙江哈尔滨150040 [2]嘉祥县工业和信息化局,山东济宁272400

出　　处：《化学与粘合》2021年第6期425-428,共4页Chemistry and Adhesion

摘　　要：以环氧树脂为树脂基体,加入一定量的无机填料、碳纤维以及环氧树脂固化剂,制备一种可以室温固化,耐1800℃烧蚀的有机胶粘剂。通过力学性能测试、黏度测试、耐烧蚀性能测试、热失重分析(TG)、扫描电镜分析(SEM)等方法对有机胶粘剂的耐烧蚀性能进行表征,结果表明该胶粘剂对于碳化硅、高温合金钢等均有较好的粘接性,室温碳化硅拉伸剪切强度大于4MPa,高温合金钢拉伸剪切强度大于15MPa;胶粘剂在1800℃条件下烧蚀2min热失重为5%;TG显示胶粘剂在Ar气氛1400℃内热失重为7%;在air气氛1400℃内热失重为0。The epoxy resin is used as the resin matrix,a certain amount of inorganic fillers,carbon fiber and epoxy resin curing agent are added to prepare an organic adhesive which can be cured at room temperature and be resistant to ablation at 1800℃.The ablation resistance of the organic adhesive is characterized through the mechanical performance test,viscosity test,ablation resistance test,thermal weight loss analysis(TG),scanning electron microscopy(SEM)analysis and other methods.The results show that the adhesive has a good adhesion to the silicon carbide and high-temperature alloy steel.The tensile shear strength of silicon carbide at room temperature is greater than 4 MPa,and the tensile shear strength of high-tem-perature alloy steel is greater than 15 MPa;the thermal weight loss of the adhesive is 5%after the ablation at 1800℃for 2 minutes;the TG shows that the thermal weight loss of the adhesive is 7%in Ar atmosphere at 1400℃;and the thermal weight loss is 0 at 1400℃in air atmosphere.

关 键 词：环氧树脂 耐烧蚀 室温固化 

分 类 号：TQ436.9[化学工程]