半导体激光器失效机理与检测分析研究进展  

Failure Mechanism and Detection Analysis of Semiconductor Laser

作　　者：孙天宇 夏明俊 乔雷 Sun Tianyu;Xia Mingjun;Qiao Lei(College of Information Science&Electronic Engineering,Zhejiang University,Hangzhou,Zhejiang 310027,China;ZTE Corporation,Shenzhen,Guangdong 518057,China)

机构地区：[1]浙江大学信息与电子工程学院,浙江杭州310027 [2]中兴通讯股份有限公司,广东深圳518057

出　　处：《激光与光电子学进展》2021年第19期37-49,共13页Laser & Optoelectronics Progress

基　　金：中兴通讯研究基金(HC-CN-20200304002)。

摘　　要：半导体激光器具有输出波长范围广、结构简单和易于集成等优势,广泛应用于医疗、传感、光学通讯、军事和航空航天等领域。随着应用需求不断增大,输出光功率不断提高,对激光器的可靠性提出了严峻的挑战。在回顾半导体激光器失效机理的基础上,分析光致发光技术、电致发光技术、阴极发光技术、红外热成像和微光显微镜5种有效的失效检测和分析手段,重点对有源区内部问题、腔面问题、焊接问题和操作环境问题的改善措施进行回顾和建议,为从事半导体激光器研究和生产的人员提供半导体激光器失效分析的依据。As semiconductor lasers have excellent characteristics including wide output wavelength range,simple structure,and easy to be integrated,they are widely used in medical,sensing,optical communications,military,and aerospace fields.With the increase of application requirements and output optical power,the reliability of lasers suffers from severe challenges.This paper reviews the failure mechanism of semiconductor lasers and analyzes the five effective failure detection and analysis methods of photoluminescence technology,electroluminescence technology,cathodoluminescence technology,infrared thermal imaging,and emission microscope.Furthermore,this paper summarizes and suggests the improvement measurements of the failure induced by the active area,cavity surface,welding,and operating environment.These will provide effective suggestions for the research and production of semiconductor lasers.

关 键 词：激光技术 半导体激光器 失效机理 失效分析 激光器缺陷检测 

分 类 号：TN365[电子电信—物理电子学]