酚醛树脂在铝基板上的应用  

Application of Phenolic⁃formaldehyde Resin on CCL

作　　者：范翠红 秦会斌[1] 周继军[1] FAN Cuihong;QIN Huibin;ZHOU Jijun(Institute of Electron Device&Application,Hangzhou Dianzi University,Hangzhou 310018,China)

机构地区：[1]杭州电子科技大学,新型电子器件与应用研究所,杭州310018

出　　处：《材料导报》2021年第S02期589-592,共4页Materials Reports

基　　金：浙江省科技计划项目(2017C01027)。

摘　　要：本研究利用耐高温固化剂制备出耐高温覆铜铝基板。根据环氧树脂、苯氧树脂、酚醛树脂、填料含量四个因素,设计不同水平的正交实验,通过极差分析和方差分析方法,确定了填料的填充量为绝缘层导热系数的重要因素,其次是酚醛树脂,酚醛树脂含量越低,覆铜铝基板的导热系数越高,最高为1.99 W/(m·K),且软化点Tg可达到229.73℃。High Temperature CCL was prepared by using high temperature’s curing agent. According to the four factors of epoxy, phenoxy, phenolicformaldehyde and the content of filler, different levels of orthogonal test were designed. Through range analysis and variance analysis, it was determined that the content of filler was an important factor of thermal conductivity of insulation layer, followed by phenolic-formaldehyde.The lower the content of phenolic-formaldehyde, the higher the thermal conductivity, and the highest was 1.99 W/(m·K), and the fusion point of T;could reach 299.53 ℃.

关 键 词：耐高温覆铜铝基板 酚醛树脂 导热系数 软化点 

分 类 号：TB332[一般工业技术—材料科学与工程]