Achieving very high cycle fatigue performance of Au thin films for flexible electronic applications  被引量:2

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作  者:Hong-Lei Chen Xue-Mei Luo Dong Wang Peter Schaaf Guang-Ping Zhang 

机构地区:[1]Shenyang National Laboratory for Materials Science,Institute of Metal Research,Chinese Academy of Sciences,Shenyang 110016,China [2]School of Materials Science and Engineering,University of Science and Technology of China,Shenyang 110016,China [3]Institute of Materials Engineering and Institute of Micro-and Nanotechnologies MacroNano®,TU Ilmenau,Gustav-Kirchhoff-Str.5,98693 Ilmenau,Germany

出  处:《Journal of Materials Science & Technology》2021年第30期107-113,共7页材料科学技术(英文版)

基  金:supported by the National Natural Science Foundation of China(NSFC,Grant Nos.52071319,51601198 and 51771207);Foundation for Outstanding Young Scholar sponsored by Institute of Metal Research(IMR),Natural Science Foundation of Liaoning Province of China(20180510025);Foundation for Outstanding Young Scholar sponsored by the Shenyang National Laboratory for Materials Science(L2019F23)。

摘  要:The fatigue damage behavior of the nanocrystalline Au films on polyimide substrates was investigated.It was found that the very high-cycle fatigue damage resistance of the Au film was significantly enhanced by at least a factor of~2 in supported loading through adding an ultrathin Ti interlayer at the Au film/polyimide interface.Such a better fatigue damage resistance is mainly ascribed to the effective suppression of voiding at the Au film/polyimide interface through modulation of the Au/Ti interface,and thus the propensity of the cyclic strain localization and grain boundary cracking is reduced.The finding may provide a potential strategy for the design of flexible devices with ultra-long fatigue life.

关 键 词:Thin films Ti interlayer FATIGUE EXTRUSION Interface 

分 类 号:TB383.2[一般工业技术—材料科学与工程]

 

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