高聚物介质中电沉积铜的试验研究  

Research on the Process of Electroforming Copper in Polymer Medium

作　　者：邢乾锋 郭钟宁[1] 罗红平[1] XING Qianfeng;GUO Zhongning;LUO Hongping(State Key Laboratory of Precision Electronic Manufacturing Technology and Equipment,Guangzhou Key Laboratory of Nontraditional Machining and Equipment,School of Electro-mechanical Engineer‐ing,Guangdong University of Technology,Guangzhou 510006,China)

机构地区：[1]广东工业大学机电工程学院省部共建精密电子制造技术与装备国家重点实验室广州市非传统制造技术及装备重点实验室,广东广州510006

出　　处：《电镀与精饰》2021年第12期34-37,共4页Plating & Finishing

基　　金：国家自然科学基金(51575113)。

摘　　要：采用扫描电子显微镜和X射线衍射技术研究以聚丙烯酰胺(PAM)为高分子聚合物介质对硫酸盐镀铜电沉积行为的影响。结果表明,与传统工艺相比,以聚丙烯酰胺为高聚物介质电沉积铜能在较低电压下获得更均匀致密的铜晶粒。在1.0 V电压下,镀层表面主要呈橄榄型锥状,铜镀层的(220)晶面的生长减弱,(111)晶面的生长则增强。In this paper,scanning electron microscope and X-ray diffraction techniques were used to study the influence of polyacrylamide(PAM)as the polymer medium on the electrodeposition behavior of sulfate copper plating.The results showed that compared with the traditional process,the use of PAM as the polymer medium for copper electrodeposition could obtain more uniform and dense copper crystal grains at a lower voltage.Under 1.0 V voltage,the surface of the plating layer was mainly olive shaped cone,the growth of the(220)crystal plane of the copper plating layer was weakened,and the growth of the(111)crystal plane was enhanced.

关 键 词：PAM 高聚物 电沉积 

分 类 号：TQ315[化学工程—高聚物工业]