Experimental Investigation on the Vapor Chambers with Sintered Copper Powder Wick  

作　　者：HUANG Dou JIA Li WU Hong AAKER Olav 

机构地区：[1]Beijing Key Laboratory of Flow and Heat Transfer of Phase Changing in Micro and Small Scale,School of Mechanical,Electronic and Control Engineering,Beijing Jiaotong University,Beijing 100044,China [2]Faculty of Engineering,0stfold University College,Box700,N-1757,Norway

出　　处：《Journal of Thermal Science》2021年第6期1938-1950,共13页热科学学报（英文版）

基　　金：supported by Fundamental Research Funds for the Central Universities(2018JBZ108);National Natural Science Foundation of China(No.51776015).

摘　　要：High power electronics units generate high-density heat flux,which poses a significant threat to the reliability of these devices.The vapor chamber(VC)has a very high heat transfer rate and has a wide range of applications in the heat dissipation of electronic products.VCs with sintered copper powder wicks sized as irregular shape copper powder 50μm(I-50μm),I-75μm,I-110μm,I-150μm were studied in this paper.The effect of liquid filling ratio was discussed.The results indicated that the thermal resistance of all VCs decreased with the increase of heating power.The capillary performance of wick was the dominant factor for the heat transfer performance of VCs with different kinds of wick.A capillary performance factor was proposed to evaluate the capillary performance of VCs.The capillary performance factor of VC with the wick of I-75μm was much higher than that of the other types of VC in this study.The heat source surface temperature of VCs could be affected by filling ratio and wick structure.But,it should be insensitive to the filling ratio when a better capillary performance factor was obtained.With the same heating area and similar structure,the maximum heat flux density of the VC would decrease as the height of vapor cavity decreased.

关 键 词：vapor chamber copper powder capillary performance heat transfer performance thermal resistance 

分 类 号：TK124[动力工程及工程热物理—工程热物理] TN60[动力工程及工程热物理—热能工程]