Effect of elevated-temperature annealing on microstructure and properties of Cu−0.15Zr alloy  

高温退火对Cu−0.15Zr合金显微组织和性能的影响

作　　者：Zi-chen ZHANG Ri-chu WANG Chao-qun PENG Yan FENG Xiao-feng WANG Xiang WU Zhi-yong CAI 张子辰;王日初;彭超群;冯艳;王小锋;吴翔;蔡志勇(中南大学材料科学与工程学院,长沙410083;中南大学电子封装与先进功能材料湖南省重点实验室,长沙410083;长沙理工大学材料科学与工程学院,长沙410114)

机构地区：[1]School of Materials Science and Engineering,Central South University,Changsha 410083,China [2]Hunan Province Key Laboratory of Electronic Packaging and Advanced Functional Materials,Central South University,Changsha 410083,China [3]College of Materials Science and Engineering,Changsha University of Science and Technology,Changsha 410114,China

出　　处：《Transactions of Nonferrous Metals Society of China》2021年第12期3772-3784,共13页中国有色金属学报（英文版）

基　　金：The authors are grateful for the financial supports from the Ministry of Science and Technology of China(No.2017YFB0305701).

摘　　要：Cu−0.15Zr(wt.%)alloy with uniform and fine microstructure was fabricated by rapid solidification followed by hot forging.Evolution of microstructure,mechanical properties and electrical conductivity of the alloy during elevated-temperature annealing were investigated.The alloy exhibits good thermal stability,and its strength decreases slightly even after annealing at 700℃ for 2 h.The nano-sized Cu_(5)Zr precipitates show significant pinning effect on dislocation moving,which is the main reason for the high strength of the alloy.Additionally,the large-size Cu_(5)Zr precipitates play a major role in retarding grain growth by pinning the grain boundaries during annealing.After annealing at 700℃ for 2 h,the electrical conductivity of samples reaches the peak value of 88%(IACS),which is attributed to the decrease of vacancy defects,dislocations,grain boundaries and Zr solutes.采用快速凝固与热锻相结合的方法,制备组织均匀、晶粒细小的Cu−0.15Zr(质量分数,%)合金,研究高温退火过程中合金显微组织演变、力学性能和电导率。该合金表现出良好的热稳定性,即使在700℃退火2 h后,合金强度仅轻微下降。退火过程中纳米级连续分布的Cu_(5)Zr析出相对位错运动起到钉扎作用,从而使基体强化,同时,尺寸较大的颗粒状Cu_(5)Zr析出相通过钉扎晶界阻碍晶粒长大。在700℃退火2 h后,由于空位、位错、晶界以及基体中溶质Zr原子减少,合金电导率达到峰值88%(IACS)。

关 键 词：Cu−Zr alloy rapid solidification ANNEALING microstructure tensile strength electrical conductivity 

分 类 号：TG156.2[金属学及工艺—热处理] TG146.11[金属学及工艺—金属学]