星载高性能计算机热设计及仿真分析  

Thermal Design and Simulation of High Performance Computer for Spacecraft Equipment

作　　者：雷冰 张琳璐 康明魁 LEI Bing;ZHANG Linlu;KANG Mingkui(No.771 Institute of China Aerospace Science and Technology Corporation,Xi’an 710119,China)

机构地区：[1]中国航天科技集团有限公司九院七七一研究所,陕西西安710119

出　　处：《电子机械工程》2021年第6期29-32,共4页Electro-Mechanical Engineering

摘　　要：随着星载嵌入式计算机向高性能、高集成、小型化方向发展,系统内热流密度急剧增加,常规星上散热设计已无法满足系统对高效散热的迫切需求。文中以某星上数据处理机热设计需求为例,提出了以石墨散热片为主的全路径高效热传导方法,并开展了整机热仿真分析和试验测试。仿真分析和试验结果均表明热设计满足要求。为进一步验证石墨散热片对导热性能的提升程度,对粘贴石墨散热片和采用常规金属两种散热方法进行了模拟仿真和对比。结果表明,与采用常规金属散热相比,在热源集中的计算模块框架上贴石墨散热片,可使数字信号处理(Digital Signal Processor, DSP)芯片的节温低4℃左右。该结论可为后续以传导为主的星上高性能计算机热设计提供参考。With development of the spacecraft embedded computers towards high performance, high integration and miniaturization, the heat flow density in system increases sharply and conventional thermal design can no longer meet the urgent needs of efficient cooling. According to the thermal design requirement of satellite data processor, a full-path efficient heat conduction method depending on graphite heat film is proposed in this paper. Simulation analysis and test are carried out and both results show that the thermal design can meet the requirement. To further verify the cooling improvement of graphite heat film, the graphite heat film and conventional metal heat conduction are compared through simulation. The results show that attaching graphite heat film on calculation frame can reduce the temperature of digital signal processor(DSP) chip about 4℃ lower than adopting conventional metal. This conclusion can be used as reference for thermal design of the high performance computer on satellites.

关 键 词：高效散热 热仿真 测试 石墨散热片 

分 类 号：TP303[自动化与计算机技术—计算机系统结构]