新一代服务器平台用无卤甚低损耗覆铜板的研制  

A halogen free and very low dielectric loss CCL for the application of next generation server platform

作　　者：何烈相 刘洋 吴彦兵 He Liexiang;Liu Yang;Wu Yanbing(SHENGYI TECHNOLOGY CO.,LTD.)

机构地区：[1]广东生益科技股份有限公司,广东东莞523808

出　　处：《印制电路信息》2021年第12期18-22,共5页Printed Circuit Information

摘　　要：文章介绍了适用于新一代服务器平台无卤甚低损耗覆铜板,其主要性能指标的典型值为:D_(f)/℃(10 GHz)=3.74/0.0050,T_(g)(DSC)=174.5℃,T_(d)(TGA)=400.5℃,搭配铜箔市场上第三代RTF铜箔,插入损耗为:-0.89 dB/in@16 GHz;可满足26层PCB板5次无铅回流焊耐热可靠性要求,且在85℃/85%RH,50 VDC的条件下,经过1000 h后不失效,具有良好的耐CAF可靠性。This paper introduced a halogen free and very low dielectric loss CCL for the application of Eagle Stream server platform.The key characteristics were as following:D_(k)/D_(f)(10 GHz)=3.74/0.0050,T_(g)(DSC)=174.5℃,Td(TGA)=400.5℃,and with the utilization of third generation of RTF Copper foil.This CCL had-0.89 dB/inch insertion loss of the PCB at 16 GHz,and could meet the processability and reliability requirements of 26-layer PCB,including no delamination or crack occurred after 5 cycles lead-free soldering reflow,and no failure occurred after 1000h treatment in the condition of 85℃/85%RH/50VDC,which possessed excellent Anti-CAF reliability.

关 键 词：服务器 无卤覆铜板 甚低损耗 

分 类 号：TN41[电子电信—微电子学与固体电子学]