超薄类挠性板单面真空热压半固化片填孔工艺研究  

Study on hole filling technology of ultra-thin soft board with single-side vacuum hot pressing PP

作　　者：陈市伟 徐天亚 黄学 Chen Shiwei;Xu Tianya;Huang Xue(APCB Electronics(Kunshan)Co.,Ltd.)

机构地区：[1]竞陆电子(昆山)有限公司,江苏昆山215000

出　　处：《印制电路信息》2021年第12期45-48,共4页Printed Circuit Information

摘　　要：由挠性转成刚性的印制板产品的类软板需求逐步扩大,对硬板厂来说最大的挑战就是对板厚的要求,全面挑战硬板生产制程极限,且需满足对类软板的品质要求,现对一种成品板厚≤0.15 mm厚度的双面类软板产品,在传统的树脂塞孔工艺上所存在的墨凸问题、研磨问题、涨缩问题、产出瓶颈问题等提出如下新型塞孔工艺的解决方案。The demand for flexible boards from flex to rigid PCB products is gradually expanding.The biggest challenge for rigid board factories is the requirement of board thickness,which comprehensively challenges the limit of rigid board production process and needs to meet the quality requirements for flexible boards.Now,for a double-sided flexible board product with finished board thickness≤0.15 mm,the ink bump problem exists in the traditional resin hole plugging process.

关 键 词：超薄类软板 单面真空热压 半固化片填孔 树脂残留 油墨凸出 

分 类 号：TN41[电子电信—微电子学与固体电子学]