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作 者:杨玉衡 Yang Yu-heng
机构地区:[1]汉高股份有限公司,上海200120
出 处:《化工设计通讯》2021年第12期118-120,共3页Chemical Engineering Design Communications
摘 要:电子行业的组装如笔记本电脑,目前大都采用双组分丙烯酸酯结构胶,相比于常规的PUR和环氧体系而言,丙烯酸酯具有更快的固化速率和平衡的抗冲击强度及黏接强度。从使用者的角度来说,希望A剂和B剂混合后,在室温情况下或-10℃的情况下,具有极长的开放时间(5~30min)。在70~90℃的热压情况下,能快速地实现定位。另外,从黏接的可靠性角度来说,客户端希望黏接后,破坏的断裂模式为100%内聚力破坏。在整个体系中,较长的开放时间,较短的定位时间和100%的内聚力破坏具有相互制约的作用。通过巧妙的设计,解决了三者之间的相互矛盾。Most of the electronic assembly industry nowadays apply the two components methyl methacrylate structural adhesive as major technology especially in laptop assembly.Compared to the PUR and epoxy technology,two components methyl methacrylate structural adhesive are excellent at the fast cure and balanced impact resistance and bonding strength.It’s highly desired from operator that after mixture of A and B components,it can have a very long open time from 5min-30min at-10oC to room temperature.When heated to 70℃-90℃ at pressure,it can be cured extremely fast.It’s also desired from customer perspective to have a more reliable bonding;thus,it’s required to have 100%cohesion failure instead of adhesive failure.In the formulation system,it’s quite difficult to have these three parameters to be presented in one system.By clever design of the curative,the contradictory parameters are properly solved.
关 键 词:双组分丙烯酸酯结构胶 过渡金属 电子组装
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