轻质、高强度隔热复合材料的无溶剂制备及性能研究  

Solvent-free Preparation and Characterization of Thermal Insulating Composite with LightWeight and High Strength

作　　者：李博 李立军[1] 杨朋飞 张金鑫[1] 冯献起 LI Bo;LI Lijun;YANG Pengfei;ZHANG Jinxin;FENG Xianqi(R&D Center of Novel Materials,Beijing New Friend Insulation Materials Co.,Ltd.,Beijing 101111,China;School of Chemistry and Chemical Engineering,Beijing Institute of Technology,Beijing 100081,China)

机构地区：[1]北京新福润达绝缘材料有限责任公司新材料研发中心,北京101111 [2]北京理工大学化学与化工学院,北京100081

出　　处：《绝缘材料》2021年第12期32-37,共6页Insulating Materials

基　　金：国家自然科学基金资助项目(21174017);河北省高等教育科学技术研究重点项目(ZD2019301)。

摘　　要：以多功能团环氧树脂MF4101为基体树脂,甲基四氢苯酐为固化剂,高强度中空玻珠为填料和隔热相,采用无溶剂BMC热压技术,成功制备了一系列高性能轻质隔热EPG复合材料,并对其结构、力学性能和热性能进行了研究。结果表明:中空玻珠平均粒径为25.6μm,且在材料中保持完整;当中空玻珠添加量为80、120、140份时,EPG复合材料的密度分别为0.82、0.72、0.71 g/cm^(3),压缩强度分别为105.7、68.1、67.4 MPa,且表现出低的导热系数,分别为0.1029、0.0854、0.0826 W/(m·K)。另外,EGP复合材料具有高的玻璃化转变温度及高的外延分解温度(>300℃),说明该材料可以在高温、高压环境中长期使用。A series of thermal insulating EPG composite with high performance and light wight were prepared through solvent-free BMC thermocompression technique using multifunctional group epoxy resin(MF4101)as matrix,methyl tetrahydrophthalic anhydride as curing agent,and hollow glass beads with high strength as filler and thermal insulating phase.And the structure,mechanical properties,and thermal properties of the composite were studied.The results show that the average particle size of hollow glass beads is 25.6μm,and it remains intact in the composite.When the amount of hollow glass beads is 80,120,and 140 phr,the density of EPG composite is 0.82,0.72,and 0.71 g/cm^(3),respectively;the compressive strength is 105.7,68.1,and 67.4 MPa,respectively;the thermal conductivity is low,the value is 0.0129,0.0854,and 0.0826 W/(m·K),respectively.Besides,with high glass transition temperatures and epitaxial degradation temperatures(>300℃),the EGP composite material can be used under high temperature and high pressure for a long time.

关 键 词：轻质 高强度 隔热复合材料 

分 类 号：TM215[一般工业技术—材料科学与工程]