基于专利分析的高频覆铜板发展态势研究  

Research on Development Status of High-frequency Copper-clad Laminate on Basis of Patent Analysis

作　　者：谌凯[1] 任英杰 张帆[1] 沈泉锦 何小玲 吴巧玲[1] SHEN Kai;REN Yingjie;ZHANG Fan;SHEN Quanjin;HE Xiaoling;WU Qiaoling(Institute of Scientific and Technical Information of Zhejiang Province,Hangzhou 310006,China;Zhejiang WAZAM New Material Co.,Ltd.,Hangzhou 311121,China)

机构地区：[1]浙江省科技信息研究院,浙江杭州310006 [2]浙江华正新材料股份有限公司,浙江杭州311121

出　　处：《绝缘材料》2021年第12期101-106,共6页Insulating Materials

基　　金：国家知识产权局专利专项研究项目(FX202008)。

摘　　要：高频覆铜板是5G相关产业发展的核心基础,技术门槛高,市场前景广阔。为厘清高频覆铜板领域的发展态势,对高频覆铜板及其关键核心技术(树脂、纤维布、填料、铜箔等)的专利大数据进行全面挖掘和深入研究。结果表明:高频覆铜板领域仍处于高速发展期,树脂、纤维布、填料、铜箔等技术演进以实现稳定的介电常数、低介质损耗为目标。美国和日本的企业占据主导地位,日立、住友、松下、三菱等日企专利申请量排名前列。我国在高频覆铜板领域起步虽晚,但发展较快,形成了广东和江苏两大研发高地,涌现了生益科技、华正新材等优势企业,但整体上专利技术缺乏核心竞争力,且面临较强专利壁垒。据此,提出了我国高频覆铜板产业高质量发展的对策建议。High-frequency copper-clad laminate is the core foundation to the development of 5G related industries,it has high technical threshold and broad market prospects.In order to clarify the development trend of high frequency copper-clad laminate field,we comprehensively excavated and deeply studied the patent big data of high-frequency copper-clad laminate and its key technologies,including resin,fiber cloth,filler,and copper foil.The results show that the field of high-frequency copper-clad laminate is still in a period of rapid development,and the technology evolution of resin,fiber cloth,filler,and copper foil are aimed at achieving stable dielectric constant and low dielectric loss.Companies from the USA and Japan occupy the dominant position,the application amount of patent form Hitachi,Sumitomo,Panasonic,Mitsubishi and other Japanese companies are in the front rank.The research on high frequency copper-clad laminate in China starts late but develops rapidly,with two major research and development highlands formed in Guangdong and Jiangsu,and advantageous enterprises emerged such as Shengyi Technology and WAZAM New Materials.However,on the whole,patent technologies of China lack core competitiveness and face strong patent barriers.Accordingly,the countermeasures and suggestions for the high-quality development of high-frequency copper-clad laminate industry in China are put forward.

关 键 词：高频覆铜板 专利分析 技术演进 

分 类 号：TM215[一般工业技术—材料科学与工程]