Ca_(0.7)La_(0.2)TiO_(3)陶瓷填充氰酸酯树脂高频介电复合材料的制备与性能  

Preparation and properties of Ca_(0.7)La_(0.2)TiO_(3) ceramic filled cyanate ester resin high frequency dielectric composite

作　　者：张恒 黄燕春 彭海益 缪金波 邓诗峰[1] 姚晓刚[2] 林慧兴[2] ZHANG Heng;HUANG Yanchun;PENG Haiyi;MIU Jinbo;DENG Shifeng;YAO Xiaogang;LIN Huixing(East China University of Science and Technology,School of Materials Science and Engineering,Key Laboratory ofSpecially Functional Polymeric Materials and Related Technology of the Ministry of Education,Shanghai 200237,China;Information Materials and Devices Research Center,Shanghai Institute of Ceramics,Chinese Academy of Science,Shanghai 200050,China)

机构地区：[1]华东理工大学材料科学与工程学院特种功能高分子材料及相关技术教育部重点实验室,上海200237 [2]中国科学院上海硅酸盐研究所信息功能材料与器件研究中心,上海200050

出　　处：《复合材料学报》2021年第11期3757-3763,共7页Acta Materiae Compositae Sinica

基　　金：装备发展部重点基金(61409220301);中央高校基本科研业务费专项资金资助(50321042017001)。

摘　　要：将具有优异介电性能的Ca_(0.7)La_(0.2)TiO_(3)陶瓷填充到氰酸酯(CE)树脂中,通过熔融浇铸技术成功制备了Ca_(0.7)La_(0.2)TiO_(3)/CE复合材料。结果表明,不同Ca_(0.7)La_(0.2)TiO_(3)填料体积分数的复合材料微观结构致密。填料体积分数为40vol%时,获得了高介电常数(ε)和低介电损耗(tanδ)(ε=25.7,tanδ=0.0055,10 GHz)的复合材料,且弯曲强度达到130 MPa,同时材料的导热系数提高到0.8601 W/(m·K),可有效进行散热。TGA结果表明,相比于CE树脂,复合材料具有更高的热稳定性,在高频通信、集成电路等领域具有良好的应用前景。The Ca_(0.7)La_(0.2)TiO_(3) ceramic with excellent dielectric properties was filled into cyanate ester(CE)resin to prepare Ca_(0.7)La_(0.2)TiO_(3)/CE composite by a melt pouring technique.The results show that dense microstructure is observed in the composites with different filler volume fractions.The Ca_(0.7)La_(0.2)TiO_(3)/CE composite with a high dielectric constant(ε)and low dielectric loss(tanδ)(ε=25.7,tanδ=0.0055,at 10 GHz)is obtained when the filler volume fraction reaches 40%.Meanwhile,the bending strength reaches 130 MPa.And the thermal conductivity increases to 0.8601 W/(m·K),which can effectively dissipate heat.TGA results show that compared with CE resin,the composites have higher thermal stability and have good application prospects in high-frequency communications,integrated circuits and other fields.

关 键 词：氰酸酯 陶瓷 介电常数 介电损耗 力学性能 热稳定性 

分 类 号：TB332[一般工业技术—材料科学与工程]