光刻机工件台模态分析与试验验证  

FEA Simulation and Test Verification of Lithography Wafer Stage

作　　者：王璟 WANG Jing(Shanghai Micro Electronics Equipment(Group)Co.,Ltd.(SMEE))

机构地区：[1]上海微电子装备(集团)股份有限公司(SMEE)

出　　处：《中国集成电路》2021年第12期48-53,共6页China lntegrated Circuit

摘　　要：模态分析是研究光刻机系统振动特性的主要方法,其具体研究方式可分为试验模态分析和有限元模态分析两种方法。基于有限元方法的模态分析,由于在建模过程中引进了一系列人为假设,因而导致了计算结果存在误差。而试验模态分析是建立在试验基础上,所得到的动态特性参数则比较真实地反映了物理模型的动力学特性。本文分别用两种方法对光刻机工件台的模态进行分析计算,并对两种方法计算的结果进行对比验证,然后根据验证结果进行有限元模型修正。这为工件台模态灵敏度分析和建立工件台结构动态性能诊断表等工作奠定了基础。A main method to study the system dynamic performance of lithographic machines is mode analysis, which can be practiced by two ways: Test and finite element analysis(FEA). Mode analysis based on FEA would bring error to the result because this method had introduced some assumption into the dynamic model. However, Test method mainly bases on test results of the real machine. And it can reflect the dynamic performance more accurately. Lithography wafer stage has been studied by these two methods, the result of which is compared and corrected. Finite element model has been amended according to the comparison and would be used in the future work. This work brings a lot of advantages to the sensitivity analysis of mode frequency and the diagnosis of dynamic performance of the wafer stage.

关 键 词：有限元 模态试验 模态 模型修正 

分 类 号：TN305.7[电子电信—物理电子学]