挠性基板叠装互联结构随机振动模态分析  

Random vibration modal analysis of flexible substrate stacked interconnect structure

作　　者：李鹏[1] 赵鲁燕 LI Peng;ZHAO Luyan(Ocean Engineering College,Guilin University of Electronic Technology,Beihai 536000,China)

机构地区：[1]桂林电子科技大学海洋工程学院,广西北海536000

出　　处：《电子设计工程》2022年第1期41-45,共5页Electronic Design Engineering

基　　金：国家自然科学基金(61474032)。

摘　　要：针对动态环境下提升电子设备抗振动、冲击性能的需求,采用ANSYS软件建立互联结构分析模型,实现了叠装互联结构随机振动模态分析。通过对比灌封材料和芯片布局条件对结构固有频率、振型的影响,得出了结构固有频率、整体及内部芯片最大形变量等参数。结果表明,环氧树脂是互联结构抗振的最佳灌封材料,芯片布局对结构模态分析影响不大。芯片布局1条件对应的结构固有振动频率最小值为4999.1 Hz,远大于随机振动频率上限,结构整体及芯片形变量最大值分别为4.108 mm和2.977 mm,处于较低形变水平。In response to the need to improve the anti-vibration and shock performance of electronic equipment in dynamic environment,ANSYS software is used to establish an interconnection structure analysis model and realize the random vibration modal analysis of the stacked interconnection structure.By comparing the effects of potting materials and chip layout conditions on the natural frequency and mode shape of the structure,the parameters such as the natural frequency of the structure,the overall and the maximum deformation displacement of the internal chip are obtained.The results show that epoxy resin is the best anti-vibration potting material for interconnect structure,and the chip layout has little effect on structural modal analysis.The chip layout 1 condition corresponds to the minimum natural vibration frequency of the structure at 4999.1 Hz,which is far greater than the upper limit of the random vibration frequency.The overall structure and the maximum chip deformation are 4.108 mm and 2.977 mm,respectively,which are at a relatively low deformation level.

关 键 词：挠性基板 模态分析 固有频率 叠装互联结构 

分 类 号：TN6[电子电信—电路与系统]