Effect of deformation of diamond anvil and sample in diamond anvil cell on the thermal conductivity measurement  

作　　者：Caihong Jia Dawei Jiang Min Cao Tingting Ji Chunxiao Gao 贾彩红;蒋大伟;曹敏;冀婷婷;高春晓(State Key Laboratory of Superhard Materials,Jilin University,Changchun 130000,China)

机构地区：[1]State Key Laboratory of Superhard Materials,Jilin University,Changchun 130000,China

出　　处：《Chinese Physics B》2021年第12期473-478,共6页中国物理B（英文版）

基　　金：Project supported by the National Key Research and Development Program of China(Grant No.2018YFA0702700);the National Natural Science Foundation of China(Grant Nos.11674404 and 11774126)。

摘　　要：Studies show that the sample thickness is an important parameter in investigating the thermal transport properties of materials under high-temperature and high-pressure(HTHP)in the diamond anvil cell(DAC)device.However,it is an enormous challenge to measure the sample thickness accurately in the DAC under severe working conditions.In conventional methods,the influence of diamond anvil deformation on the measuring accuracy is ignored.For a hightemperature anvil,the mechanical state of the diamond anvil becomes complex and is different from that under the static condition.At high temperature,the deformation of anvil and sample would be aggravated.In the present study,the finite volume method is applied to simulate the heat transfer mechanism of stable heating DAC through coupling three radiativeconductive heat transfer mechanisms in a high-pressure environment.When the temperature field of the main components is known in DAC,the thermal stress field can be analyzed numerically by the finite element method.The obtained results show that the deformation of anvil will lead to the obvious radial gradient distribution of the sample thickness.If the top and bottom surfaces of the sample are approximated to be flat,it will be fatal to the study of the heat transport properties of the material.Therefore,we study the temperature distribution and thermal conductivity of the sample in the DAC by thermal-solid coupling method under high pressure and stable heating condition.

关 键 词：diamond anvil cell DEFORMATION thermal conductivity thermal-solid coupling method 

分 类 号：O551.3[理学—热学与物质分子运动论]