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作 者:张倩[1] 李秀青[2,3] 魏世忠[2,3] 王琪 娄文鹏 徐流杰[2,3] ZHANG Qian;LI Xiuqing;WEI Shizhong;WANG Qi;LOU Wenpeng;XU Liujie(Materials Science&Engineering School,Henan University of Science&Technology,Luoyang 471023,China;National Joint Engineering Research Center for Abrasion Control and Molding of Metal Materials,Henan University of Science&Technology,Luoyang 471023,China;Henan Key Laboratory of High-temperature Structural and Functional Materials,Henan University of Science&Technology,Luoyang 471023,China)
机构地区:[1]河南科技大学材料科学与工程学院,河南洛阳471023 [2]河南科技大学金属材料磨损控制与成型技术国家地方联合工程研究中心,河南洛阳471023 [3]河南科技大学河南省高温结构与功能材料重点实验室,河南洛阳471023
出 处:《河南科技大学学报(自然科学版)》2022年第2期7-12,M0002,M0003,共8页Journal of Henan University of Science And Technology:Natural Science
基 金:国家自然科学基金项目(U2004180);河南省科技攻关项目(212102210453)。
摘 要:借助扫描电子显微镜和显微硬度计等手段,研究了压缩变形与退火工艺对纯铜组织和性能的影响,获得了不同变形程度纯铜在不同退火条件下的组织演变和性能变化规律。研究结果表明:晶粒粗大的工业纯铜经室温压缩变形+退火可获得晶粒细小的组织。对于冷变形程度为40%的纯铜,最佳退火工艺为450℃×15 min;对于冷变形程度为80%的纯铜,最佳退火工艺为350℃×15 min,继续升高退火温度和延长保温时间都会使再结晶晶粒不断长大。与冷变形程度40%的纯铜试样相比,冷变形程度80%的纯铜试样退火后晶粒更细小。在本试验条件下,随着退火温度的升高和保温时间的延长,试样硬度总体呈下降趋势。纯铜的平均晶粒尺寸可以由铸态的150μm细化到12.15μm。The effects of compression deformation and annealing process on the microstructure and properties of pure copper were studied by means of scanning electron microscope and microhardness tester. The microstructure evolution and properties of pure copper with different deformation degree under different annealing conditions were obtained. The results show that fine grain structure is obtained by compression deformation and annealing at room temperature. For pure copper with 40% cold deformation,the optimum annealing process is 450 ℃ for 15 min. For pure copper with 80% deformation,the optimum annealing process is 350 ℃ for 15 min,then increasing the annealing temperature and prolonging the holding time will make the recrystallized grains grow continuously. Compared with the pure copper sample with 40%deformation,the pure copper sample with 80% deformation has finer grains after annealing. Under the experimental conditions,the hardness of the sample is decreased with the increase of annealing temperature and holding time. The average grain size of pure copper can be refined from 150 μm to 12. 15 μm.
分 类 号:TG146.11[一般工业技术—材料科学与工程]
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