集成电路产业封装测试领域共性技术识别研究——基于专利计量的视角  

Research on Generic Technology Identification in the Packaging and Testing Field of Integrate Circuit(IC)Industry——Based on the Perspective of Patent Measurement

作　　者：张清辉[1] 杨舒茜 ZHANG Qinghui;YANG Shuqian(School of Economics and Management,Lanzhou University of Technology,Lanzhou 730050)

机构地区：[1]兰州理工大学经济管理学院,兰州730050

出　　处：《科技促进发展》2021年第7期1272-1283,共12页Science & Technology for Development

基　　金：2011年国家社会科学基金面上项目(10BGL034):战略性新兴产业共性技术开发与政策创新研究,负责人:张清辉。

摘　　要：考虑到共性技术的识别可以实现精准分配资源从而推动产业技术升级、经济持续增长和提高产业的全球竞争力,基于专利的社会网络分析法,构建了专利技术共现网络及专利共被引网络,并分析了全球集成电路封装测试技术的专利增长趋势及共性技术领域。研究发现,1980年以来封装测试技术专利申请量呈指数增长,并且识别出集成电路封装测试领域的共性技术集中在H01L021、H01L023、H01L025及G01R031,涵盖蚀刻工艺、封装涂层、引线装置、安装架、电性能测试等工艺流程。Considering that identification of generic technologies can achieve precise allocation of resources to promote industrial technology upgrading,sustained economic growth and increase the global competitiveness of the industry,a patent technology co-occurrence network and a patent co-citation network were constructed based on the patented social network analysis method,and the patent growth trend of global integrated circuit packaging and testing technologies and generic technical fields were analyzed.The study found that the number of patent applications for packaging and testing technology increased exponentially since 1980,and the generic technologies identified in the field of packaging and testing of integranted circuit industry were concentrated in H01L021,H01L023,H01L025 and G01R031,covering etching processes,packaging coatings,lead devices,and mounting frames,electrical performance testing and other technological processes.

关 键 词：集成电路产业 共性技术 专利计量 社会网络分析 

分 类 号：TN40[电子电信—微电子学与固体电子学] G255.53[文化科学—图书馆学]